vnq600ptr-e STMicroelectronics, vnq600ptr-e Datasheet

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vnq600ptr-e

Manufacturer Part Number
vnq600ptr-e
Description
Quad Channel High Side Driver
Manufacturer
STMicroelectronics
Datasheet

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Part Number:
VNQ600PTR-E
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Part Number:
VNQ600PTR-E
Manufacturer:
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0
Features
1. Per each channel.
a. See
Table 1.
November 2008
Max supply voltage
Max On-state resistance
Current limitation (typ.)
DC short circuit current: 22A
CMOS compatible inputs
Proportional load current sense.
Undervoltage & overvoltage shutdown
Overvoltage clamp
Thermal shutdown
Current limitation
Very low standby power dissipation
Protection against:
– Loss of ground & loss of V
Reverse battery protection
In compliance with the 2002/95/EC european
directive
Application schematic on page 17
SO-28 (double island)
Device summary
Package
R
V
I
LIM
CC
ON
(a)
CC
35mΩ
36V
25A
(1)
VNQ600P-E
Tube
Rev 3
Description
The VNQ600P-E is a quad HSD formed by
assembling two VNQ600P-E chips in the same
SO-28 package. The VNQ600P-E is a monolithic
device designed
M0-3 Technology. The VNQ600P-E is intended for
driving any type of multiple loads with one side
connected to ground.
This device has four independent channels and
four analog sense outputs which deliver currents
proportional to the outputs currents.
Active current limitation combined with thermal
shutdown and automatic restart protect the device
against overload. Device automatically turns off in
case of ground pin disconnection.
Quad channel high side driver
Order codes
SO-28 (double island)
in|
STMicroelectronics VIPower
Tape and reel
VNQ600PTR-E
VNQ600P-E
www.st.com
1/26
26

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vnq600ptr-e Summary of contents

Page 1

... Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. Device automatically turns off in case of ground pin disconnection. Tube VNQ600P-E Rev 3 VNQ600P-E SO-28 (double island) in| STMicroelectronics VIPower Order codes Tape and reel VNQ600PTR-E 1/26 www.st.com 26 ...

Page 2

Contents Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical ...

Page 3

VNQ600P-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

List of figures List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

VNQ600P-E 1 Block diagram and pin description Figure 1. Block diagram INPUT 1 INPUT 2 GND 1,2 INPUT 3 INPUT 4 GND 3,4 OVERVOLTAGE UNDERVOLTAGE DRIVER 1 LOGIC DRIVER 2 OVERTEMP. 1 OVERTEMP. 2 OVERVOLTAGE UNDERVOLTAGE DRIVER 3 LOGIC DRIVER ...

Page 6

Block diagram and pin description Figure 2. Configuration diagram (top view) CURRENT CURRENT SENSE 2 CURRENT SENSE 3 CURRENT SENSE 4 Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground 6/26 V 1,2 ...

Page 7

... These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3. ...

Page 8

Electrical specifications 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-lead thj-lead Thermal resistance junction-ambient R thj-amb (one chip ON) Thermal Resistance junction-ambient R thj-amb (two chips ON) 1. When mounted on a standard single-sided ...

Page 9

VNQ600P-E Table 5. Power Symbol V Operating supply voltage CC V Undervoltage shutdown USD V Overvoltage shutdown state resistance ON V Clamp voltage clamp I Supply current S I Off state output current L(off1) I Off state ...

Page 10

Electrical specifications . Table 7. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) (dV /dt) Turn-on voltage slope OUT on (dV /dt) Turn-off voltage slope OUT off Table 8. Current sense (9V< V Symbol Parameter ...

Page 11

VNQ600P-E Table 8. Current sense (9V< V Symbol Parameter Analog sense output Impedance in R VSENSEH overtemperature condition Current sense delay t DSENSE response 1. Current sense signal delay after positive input slope. Table 9. Logic inputs Symbol V Low ...

Page 12

Electrical specifications Figure 5. Switching characteristics V OUT dV OUT I SENSE INPUT Table 11. Truth table Conditions Normal operation Overtemperature Undervoltage Overvoltage Short circuit to GND Short circuit Negative output voltage clamp 12/26 80% /dt (on) ...

Page 13

VNQ600P-E Table 12. Electrical transient requirements ISO T/R 7637/1 Test pulse ISO T/R 7637/1 Test pulse Class All functions of the device are performed as designed after exposure ...

Page 14

Electrical specifications Figure 6. Waveforms INPUT n LOAD CURRENT SENSE INPUT n LOAD CURRENT SENSE INPUT n LOAD CURRENT SENSE n INPUT n LOAD CURRENT LOAD VOLTAGE SENSE n INPUT n LOAD VOLTAGE LOAD ...

Page 15

VNQ600P-E 2.4 Electrical characteristics curves Figure 7. Off state output current Figure 9. Input clamp voltage Vicl (V) 8 7.8 I in= 1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 - (°C ...

Page 16

Electrical specifications Figure 13 LIM case Figure 15. Input high level Vih (V) 3.6 3.4 3.2 3 2.8 2.6 2.4 2.2 2 -50 - (°C ) Figure 17. On state resistance vs ...

Page 17

VNQ600P-E 3 Application information Figure 18. Application schematic +5V R prot R prot R prot µC R prot R prot R prot R prot R prot Note: Channels 3 & 4 have the same internal circuit as channel 1 & ...

Page 18

Application information This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where I maximum on-state currents of the different devices. Please note that, if the microprocessor ...

Page 19

VNQ600P-E 3.4 Maximum demagnetization energy (V Figure 19. Maximum turn-off current versus load inductance I LMAX (A) 100 10 1 0.001 A = Single Pulse Repetitive pulse Repetitive Pulse ...

Page 20

Package and PCB thermal data 4 Package and PCB thermal data 4.1 SO-28 thermal data Figure 20. SO-28 PC board Note: Layout condition of R thickness=2mm, Cu thickness=35µm, Copper areas: 0.5 cm Table 13. Thermal calculation according to the PCB ...

Page 21

VNQ600P-E Figure 21. R thj-amb RTHj_amb (° Figure 22. Thermal impedance junction ambient single pulse Zth(°C/ W) 100 10 1 0.1 0.01 0.0001 0.001 Vs PCB copper area in open box ...

Page 22

Package and PCB thermal data Equation 1 pulse calculation formula : ⋅ δ THδ TH δ ⁄ where p Figure 23. Thermal fitting model of a quad channel HSD in SO- ...

Page 23

VNQ600P-E 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and ...

Page 24

Package and packing information 5.2 SO-28 packing information Figure 25. SO-28 tube shipment (no suffix) C Figure 26. SO-28 tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape ...

Page 25

VNQ600P-E 6 Revision history Table 16. Document revision history Date Oct-2004 02-Jul-2006 11-Nov-2008 Revision 1 Initial release. 2 Added Table 16: Document revision 3 Document converted to corporate template. Revision history Changes history. 25/26 ...

Page 26

... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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