vnq600ptr-e STMicroelectronics, vnq600ptr-e Datasheet - Page 20

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vnq600ptr-e

Manufacturer Part Number
vnq600ptr-e
Description
Quad Channel High Side Driver
Manufacturer
STMicroelectronics
Datasheet

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Package and PCB thermal data
4
4.1
Note:
20/26
Package and PCB thermal data
SO-28 thermal data
Figure 20. SO-28 PC board
Layout condition of R
thickness=2mm, Cu thickness=35µm, Copper areas: 0.5 cm
Table 13.
R
R
R
Chip 1 Chip 2
thA
thB
thC
OFF
ON
ON
ON
= Thermal resistance Junction to Ambient with both chips ON and P
= Thermal resistance Junction to Ambient with one chip ON
= Mutual thermal resistance
OFF
ON
ON
ON
Thermal calculation according to the PCB heatsink area
R
R
R
T
(R
P
amb
dchip2
thA
thC
thB
thA
th
x P
x (P
x P
x P
and Z
+ T
dchip1
dchip2
dchip1
dchip1
amb
T
th
jchip1
+ T
+ T
) + R
+ P
measurements (PCB FR4 area= 58mm x 58mm, PCB
amb
amb
dchip2
thC
x
) +
R
R
R
T
(R
P
amb
dchip1
thC
thA
thB
thA
x P
x P
x (P
x P
+ T
dchip2
dchip1
dchip1
dchip2
amb
T
jchip2
+ T
+ T
) + R
+ P
2
, 3 cm
amb
amb
dchip2
thC
x
2
) +
, 6 cm
dchip1
2
).
P
P
dchip1
dchip1
=P
VNQ600P-E
Note
dchip2
=P
≠P
dchip2
dchip2

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