hcs32dmsr Intersil Corporation, hcs32dmsr Datasheet - Page 3

• Manufacturer Part Number: hcs32dmsr
• Description: Rad-hard Quad 2-input Or Gate
• Manufacturer: Intersil Corporation

DC Electrical Electrical Performance Characteristics
NOTES:
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input Voltage Range, All Inputs . . . . . . . . . . . . . -0.5V to VCC +0.5V
DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . ±10mA
DC Drain Current, Any One Output . . . . . . . . . . . . . . . . . . . . ±25mA
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG). . . . . . . . . . . .-65°C to +150°C
Lead Temperature (Soldering 10sec). . . . . . . . . . . . . . . . . . . +265°C
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Times at VCC = 4.5V (TR, TF) . . . 100ns/V Max
Operating Temperature Range (TA). . . . . . . . . . . . .-55°C to +125°C
Input Low Voltage (VIL) . . . . . . . . . . . . . . . . . . . 0.0V to 30% of VCC
Input High Voltage (VIH) . . . . . . . . . . . . . . . . . .70% of VCC to VCC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Quiescent Current
Output Current (Sink)
Output Current (Source)
Output Voltage Low
Output Voltage High
Input Leakage Current
Noise Immunity Functional Test
3. This is just to show continuing notes in the document.
4. This is a row format electrical spec table.
1. θ
2. For θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JC
PARAMETER
, the “case temp” location is the center of the exposed metal pad on the package underside.
3
SYMBOL
VOH
VOL
IOH
ICC
IOL
FN
IIN
VCC = 5.5V, VIN = VCC or
GND
VCC = 4.5V, VIH = 4.5V,
VOUT = 0.4V, VIL = 0V
VCC = 4.5V, VIH = 4.5V,
VOUT = VCC -0.4V,
VIL = 0V
VCC = 4.5V, VIH = 3.15V,
IOL = 50μA, VIL = 1.35V
VCC = 5.5V, VIH = 3.85V,
IOL = 50μA, VIL = 1.65V
VCC = 4.5V, VIH = 3.15V,
IOH = -50μA, VIL = 1.35V
VCC = 5.5V, VIH = 3.85V,
IOH = -50μA, VIL = 1.65V
VCC = 5.5V, VIN = VCC or
GND
VCC = 4.5V, VIH = 0.70
(VCC), VIL = 0.30(VCC),
(Note 3)
TEST CONDITIONS
HCS32MS
Thermal Information
Thermal Resistance (Notes 1, 2)
Maximum Package Power Dissipation at +125°C Ambient
SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.68W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . . .0.43W
If device power exceeds package dissipation capability, provide heat
sinking or derate linearly at the following rate:
SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13.5mW/°C
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . .8.6mW/°C
SUBGROUPS
SBDIP Package . . . . . . . . . . . . . . . . .
Ceramic Flatpack Package . . . . . . . . .
GROUP A
7, 8A, 8B
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
2, 3
2, 3
2, 3
2, 3
1
1
1
1
+25, +125, -55
+25, +125, -55
+25, +125, -55 VCC - 0.1
+25, +125, -55 VCC - 0.1
+25, +125, -55
TEMP (°C)
+125, -55
+125, -55
+125, -55
+125, -55
+25
+25
+25
+25
MIN
-4.8
-4.0
4.8
4.0
-
-
-
-
-
-
-
LIMITS
116°C/W
74°C/W
θJA
MAX
±0.5
±5.0
200
0.1
0.1
10
-
-
-
-
-
-
-
April 11, 2007
24°C/W
30°C/W
UNITS
θJC
FN3057.1
mA
mA
mA
mA
μA
μA
μA
μA
V
V
V
V
-