lpc11u23 NXP Semiconductors, lpc11u23 Datasheet - Page 64
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
lpc11u23
Manufacturer Part Number
lpc11u23
Description
32-bit Arm Cortex-m0 Microcontroller; Up To 32 Kb Flash; Up To 10 Kb Sram And 4 Kb Eeprom; Usb Device; Usart
Manufacturer
NXP Semiconductors
Datasheet
1.LPC11U23.pdf
(70 pages)
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NXP Semiconductors
LPC11U2X
Product data sheet
Fig 40. Reflow soldering for the TFBGA48 package
Footprint information for reflow soldering of TFBGA48 package
DIMENSIONS in mm
0.50
P
0.225
SL
0.275
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.325
SR
P
4.75
Hx
4.75
Hy
All information provided in this document is subject to legal disclaimers.
P
Rev. 2 — 13 January 2012
Hx
32-bit ARM Cortex-M0 microcontroller
detail X
SR
SL
SP
see detail X
LPC11U2x
© NXP B.V. 2012. All rights reserved.
sot1155-2_fr
SOT1155-2
64 of 70
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