lv8762t Sanyo Semiconductor Corporation, lv8762t Datasheet - Page 4

• Manufacturer Part Number: lv8762t
• Description: Forward/reverse H-bridge Driver
• Manufacturer: Sanyo Semiconductor Corporation

Substrate Specifications (Substrate recommended for operation of LV8762T)
Cautions
Size
Material
1) For the set design, employ the derating design with sufficient margin.
2) After the set design, be sure to verify the design with the actual product.
(1)Maximum value 80% or less for the voltage rating
(2)Maximum value 80% or less for the current rating
(3)Maximum value 80% or less for the temperature rating
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as
vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below :
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,
possibly resulting in thermal destruction of IC.
L1 : Copper wiring pattern diagram
: 57mm × 57mm × 1.6mm (two-layer substrate)
: Glass epoxy both-type board
2.0
1.5
1.0
0.5
—
0
20
0
Ambient temperature, Ta -
20
Pd max
LV8762T
1.40
40
-
Ta
60
L2 : Copper wiring pattern diagram
C
80
0.73
100
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