s71ws256n Meet Spansion Inc., s71ws256n Datasheet - Page 9

• Manufacturer Part Number: s71ws256n
• Description: Stacked Multi-chip Product Mcp
• Manufacturer: Meet Spansion Inc.

5.3
July 19, 2006 S71WS-N_00_A6
5.2.2
5.3.1
Physical Dimensions
Look-Ahead Pinout for Future Designs
TLA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 11.6 x 8.0 x 1.2 mm
Please refer to the Design-in Scalable Wireless Solutions with Spansion Products application note
(publication number: Design_Scalable_Wireless_A0_E). Contact your local Spansion sales representative for
more details.
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
MD
ME
Ø b
D1
eD
A1
A2
E1
eE
A
D
E
n
D a t a
CORNER
0.15
(2X)
PIN A1
A2
A1
H1,H10,J1,J10,K1,K10,L1,L10,
C
M2,M3,M4,M5,M6,M7,M8,M9
0.17
0.81
0.35
MIN
A2,A3,A4,A5,A6,A7,A8,A9
84X
---
B1,B10,C1,C10,D1,D10,
E1,E10,F1,F10,G1,G10,
11.60 mm x 8.00 mm
0.15
0.08
S h e e t
INDEX MARK
11.60 BSC.
PACKAGE
6
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
TLA 084
b
NOM
0.40
M
M
N/A
10
---
---
---
12
10
84
C A B
C
SIDE VIEW
TOP VIEW
MAX
1.20
0.97
0.45
( A d v a n c e
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
S71WS-N
I n f o r m a t i o n )
C
A
0.15
(2X)
E
B
C
0.20 C
0.08
eE
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
10
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M L
K
SD
BOTTOM VIEW
7
J
H
G
D1
F
E
D C
B
A
SE
CORNER
PIN A1
3372-2 \ 16-038.22a
7
E1
7