am49dl6408h Meet Spansion Inc., am49dl6408h Datasheet - Page 56

• Manufacturer Part Number: am49dl6408h
• Description: Stacked Multi-chip Package Mcp Flash Memory And Sram, 64 Megabit 4 M ? 16-bit Cmos 3.0 Volt-only, Simultaneous Operation Flash Memory And 8 Mbit 512 K ? 16-bit Pseudo Static Ram
• Manufacturer: Meet Spansion Inc.

PHYSICAL DIMENSIONS
FLJ073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
54
A
PACKAGE
JEDEC
SYMBOL
SD / SE
CORNER
MD
ME
0.15
(2X)
PIN A1
A1
A2
D1
E1
eE
eD
φb
A2
A
D
E
n
A1
C
C2,C9,C10,D1,D10,E1,E10,F5,F6,G5,G6,H1,H10
A2,A3,A4,A5,A6,A7,A8,A9,B2,B3,B4,B7,B8,B9
0.25
0.95
0.30
MIN
73X
J1,J10,K1,K2,K9,K10,L2,L3,L4,L7,L8,L9
---
INDEX MARK
11.60 mm x 8.00 mm
M2,M3,M4,M5,M6,M7,M8,M9
0.15
0.08
11.60 BSC.
PACKAGE
10
6
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.80 BSC.
0.40 BSC.
FLJ 073
b
NOM
0.35
M
M
N/A
---
---
---
12
10
73
C
C
A
B
MAX
SIDE VIEW
1.40
1.13
0.40
TOP VIEW
---
D
A D V A N C E
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
Am49DL6408H
C
A
0.15
(2X)
E
B
I N F O R M A T I O N
C
eE
0.20 C
0.08
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
10
C
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER ASME
Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
NOT USED.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M
L
K
SD
J
7
BOTTOM VIEW
H
G
D1
F
E
D C
B
A
March 12, 2004
SE
CORNER
PIN A1
3232 \ 16-038.14b
7
E1