s72ns02gsf0yhmg9 Meet Spansion Inc., s72ns02gsf0yhmg9 Datasheet - Page 9

• Manufacturer Part Number: s72ns02gsf0yhmg9
• Description: S72ns-s Mirrorbit Eclipse? Flash Memory And Dram 2 Gb 128m X 16 Bit , 1.8 Volt-only, Multiplexed Simultaneous Read/ Write, Burst Mode Flash Memory 512 Mb 32m X 16 Bit Ddr Dram On Split Bus
• Manufacturer: Meet Spansion Inc.

6.
6.1
January 9, 2009 S72NS-S_00_02
Physical Dimensions
ALN186—186-ball Fine-Pitch Ball Grid Array (FBGA) 11.0 x 13.0 mm
PACKAGE
SYMBOL
SD SE
D a t a
JEDEC
D x E
MD
ME
Ø b
A1
A2
D1
E1
eE
eD
A
D
E
n
0.325
0.20
0.79
MIN
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13.00 mm x 11.00 mm
S h e e t
PACKAGE
13.00 BSC
11.00 BSC
10.40 BSC
7.80 BSC
0.65 BSC
0.65 BSC
0.00 BSC
ALN 186
NOM
0.375
N/A
186
---
---
---
17
13
( A d v a n c e
0.425
MAX
1.20
0.95
---
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S72NS-S Based MCPs
NOTE
I n f o r m a t i o n )
NOTES:
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2.
3.
4.
5.
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DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3707 \ 16-038.24 \ 9.308
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