m464s6453cks Samsung Semiconductor, Inc., m464s6453cks Datasheet

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m464s6453cks

Manufacturer Part Number
m464s6453cks
Description
Pc133/pc100 Sodimm
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
This is to advise Samsung customers that, until August 1, 2003, in accordance with certain terms of an agreement, Samsung is prohibited
from selling any DRAM products configured in "Multi-Die Plastic" format for use as components in general and scientific computers, such as
mainframes, servers, work stations or desk top personal computers (hereinafter "Prohibited Computer Use"). Applications such as mobile,
including cell phones, telecom, including televisions and display monitors, or non-desktop computer systems, including laptops, notebook
computers, are, however, permissible. "Multi-Die Plastic" is defined as two or more Dram die encapsulated within a single plastic leaded
package
M464S6453CKS
Revision 0.0 (Sept. 2001)
Revision 0.1 (Feb. 2002)
Revision History
- Typo in SPD 127byte corrected
PC133/PC100 SODIMM
Rev. 0.1 Feb. 2002

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m464s6453cks Summary of contents

Page 1

... M464S6453CKS Revision History Revision 0.0 (Sept. 2001) Revision 0.1 (Feb. 2002) - Typo in SPD 127byte corrected This is to advise Samsung customers that, until August 1, 2003, in accordance with certain terms of an agreement, Samsung is prohibited from selling any DRAM products configured in "Multi-Die Plastic" format for use as components in general and scientific computers, such as mainframes, servers, work stations or desk top personal computers (hereinafter " ...

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... M464S6453CKS SDRAM SODIMM 64Mx64 SDRAM SODIMM based on 64Mx8, 4Banks, 8K Refresh,3.3V Synchronous DRAMs with SPD GENERAL DESCRIPTION The Samsung M464S6453CKS is a 64M bit x 64 Synchronous Dynamic RAM high density memory module. The Samsung M464S6453CKS consists of eight CMOS 64M x 8 bit with 4banks Synchronous DRAMs in TSOP-II 400mil package and a 2K EEPROM in 8-pin TSSOP package on a 144-pin glass-epoxy substrate ...

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... M464S6453CKS PIN CONFIGURATION DESCRIPTION Pin Name CLK System clock CS Chip select CKE Clock enable A0 ~ A12 Address BA0 ~ BA1 Bank select address RAS Row address strobe CAS Column address strobe WE Write enable DQM0 ~ 7 Data input/output mask Data input/output Power supply/ground ...

Page 4

... M464S6453CKS FUNCTIONAL BLOCK DIAGRAM CKE1 CKE0 DQM CS0 DQ0 DQ0 DQ1 DQ1 DQ2 DQ2 DQ3 DQ3 DQ4 DQ4 DQ5 DQ5 DQ6 DQ6 DQ7 DQ7 DQM1 DQM CS0 CS1 DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 ...

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... M464S6453CKS ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative to Vss Voltage on V supply relative to Vss D D Storage temperature Power dissipation Short circuit current Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to recommended operating condition. ...

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... M464S6453CKS DC CHARACTERISTICS (Recommended operating condition unless otherwise noted, T Sym- Parameter bol Operating current I CC1 (One bank active CC2 Precharge standby current in power-down mode CC2 Precharge standby current in non power-down mode I NS CC2 I P CC3 Active standby current in ...

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... M464S6453CKS AC OPERATING TEST CONDITIONS Parameter AC input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition 3.3V 1200 Output 50pF 870 (Fig output load circuit OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) ...

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... M464S6453CKS AC CHARACTERISTICS (AC operating conditions unless otherwise noted) REFER TO THE INDIVIDUAL COMPONENT, NOT THE WHOLE MODULE. Parameter CAS latency=3 CLK cycle time CAS latency=2 CAS latency=3 CLK to valid output delay CAS latency=2 CAS latency=3 Output data hold time CAS latency=2 CLK high pulse width ...

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... M464S6453CKS SIMPLIFIED TRUTH TABLE Command Register Mode register set Auto refresh Entry Refresh Self refresh Exit Bank active & row addr. Read & Auto precharge disable column address Auto precharge enable Write & Auto precharge disable column address Auto precharge enable ...

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... M464S6453CKS PACKAGE DIMENSIONS 0.16 0.039 (4.00 0.10) 1 0.13 (3.30) 0.15 (3.70) 2 0.150 Max (3.80 Max) 0.04 0.0039 (1.00 0.10) Tolerances : .006(.15) unless otherwise specified The used device is 64Mx8 SDRAM, TSOP SDRAM Part No. : K4S510832C 2.66 (67.60) 2.50 (63.60 0.91 1.29 (23.20) (32.80) 0.18 (4.60) 0.083 (2.10) 0.10 (2.50 0.16 0.0039 (4.00 0.10) 0.06 0.0039 (1.50 0.1) Detail Z PC133/PC100 SODIMM Units : Inches (Millimeters) 2-R 0.078 Min (2.00 Min) 143 2- 0.07 (1.80) Y 144 0.024 ...

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... M464S6453CKS M464S6453CKS-L7A/L1H/L1L, C7A/C1H/C1L(Intel SPD 1.2B ver. based) •Organization : 64MX64 •Composition : 64MX8 *8 •Used component part # : K4S510832C-L7A/C7A/L1H/C1H/L1L/C1L •# of rows in module : 2 rows •# of banks in component : 4 banks •Feature : 1,200 mil height & double sided •Refresh : 8K/64ms •Contents : Byte Function described # bytes written into serial memory at module manufacturer ...

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... M464S6453CKS SERIAL PRESENCE DETECT INFORMATION Byte # Function described 35 Data signal input hold time 36~61 Superset information (maybe used in future) 62 SPD data revision code 63 Checksum for bytes Manufacturer JEDEC ID code 65~71 ...... Manufacturer JEDEC ID code 72 Manufacturing location 73 Manufacturer part # (Memory module) 74 Manufacturer part # (DIMM Configuration) ...

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