hys64d64020gbdl-5-c Qimonda, hys64d64020gbdl-5-c Datasheet
hys64d64020gbdl-5-c
Related parts for hys64d64020gbdl-5-c
hys64d64020gbdl-5-c Summary of contents
Page 1
– 5 – – 5 – – 6 ...
Page 2
... HYS64D64020HBDL–5–C, HYS64D64020GBDL–5–C, HYS64D64020HBDL–6–C, HYS64D64020GBDL–6–C Revision History: 2007-01, Rev. 1.21 Page Subjects (major changes since last revision) All Qimonda update All Adapted internet edition Previous Revision: 2005-09, Rev. 1.2 We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document ...
Page 3
... Max. Clock Frequency @CL3 @CL2.5 @CL2 Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules • Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave) • Auto Refresh (CBR) and Self Refresh t • RAS-lockout Supported RAP • ...
Page 4
... Description The HYS64D64020HBDL–5–C and HYS64D64020GBDL–5– C are industry standard 200-Pin Small Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 64M ×64. The memory array is designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling Type Compliance Code PC3200 (CL=3.0) HYS64D64020GBDL– ...
Page 5
... CAS I 119 WE I Address Signals 117 BA0 I 116 BA1 I Rev. 1.21, 2007-01 03292006-F1IB-1I3E Small Outline DDR SDRAM Modules explained in Table 5 (184 pins). The numbering is depicted in Buffer Function Type SSTL Clock Signal SSTL Clock Signal SSTL Clock Signal Note: ECC type module — ...
Page 6
... SSTL Address Signal 12 Note: Module based on 256 Mbit or larger dies — Note: 128 Mbit based module SSTL Address Signal 13 Note: 1 Gbit based module — Note: Module based on 512 Mbit or smaller dies SSTL Data Bus 63:0 SSTL SSTL SSTL SSTL SSTL SSTL SSTL ...
Page 7
... DQ49 I/O 171 DQ50 I/O 175 DQ51 I/O 164 DQ52 I/O 166 DQ53 I/O Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules Buffer Function Type SSTL Data Bus 63:0 SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL ...
Page 8
... CB5 I CB6 I CB7 I Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules Buffer Function Type SSTL Data Bus 63:0 SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL Check Bit 0 Note: ECC type module — ...
Page 9
... SA2 I Power Supplies V 1,2 AI REF V 197 PWR DDSPD Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules Buffer Function Type SSTL Data Strobes 7:0 SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL Data Strobe 8 Note: ECC type module — ...
Page 10
... Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules Buffer Function Type — Power Supply 10 Internet Data Sheet ...
Page 11
... Other Pins V 199 O DDID 85 86, 97, 98, 124, 200 Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules Buffer Function Type — Ground Plane V OD Identification DD — Not connected 11 Internet Data Sheet ...
Page 12
... Open Drain. The corresponding pin has 2 operational states, active low and tristate, and allows multiple devices to share as a wire-OR. Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules Abbreviations for Pin Type Abbreviations for Buffer Type 12 Internet Data Sheet ...
Page 13
... Rev. 1.21, 2007-01 03292006-F1IB-1I3E Pin Configuration Diagram 200-Pin SO-DIMM SDRAMs # row/bank/ SDRAMs columns bits 32M ×8 16 13/2/10 13 Internet Data Sheet HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules FIGURE 1 TABLE 7 Address Format Refresh Period Interval 7.8 ms ...
Page 14
... Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules Absolute Maximum Ratings Symbol Values Min. ...
Page 15
... system supply for signal termination resistors, is expected to be set equal REF stabilizes. REF 15 Internet Data Sheet HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules TABLE 9 1) Unit Note / Test Condition f ≤ 166 MHz > 166 MHz ...
Page 16
... V . IH,MIN IL,MAX for DQ, DQS and DM. ILMAX IN REF IH,MIN RC RAS,MAX OUT 16 Internet Data Sheet HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules TABLE 10 I Conditions DD Symbol I DD0 I DD1 I DD2P I DD2F I DD2Q I DD3P I DD3N I DD4R I DD4W I DD5 I DD6 ...
Page 17
... Product Type HYS64D64020GBDL–5–C HYS64D64020HBDL–5–C Organization 512MB × Ranks –5 Symbol Typ. I 940 DD0 I 1100 DD1 I 480 DD2P I 320 DD2F I 210 DD2Q I 610 DD3P I 690 DD3N I 1140 DD4R I 1140 DD4W I 360 DD5 I 16 DD6 I 2020 DD7 I 1) Module ...
Page 18
... Product Type HYS64D64020GBDL–6-–C HYS64D64020HBDL–6–C Organization 512MB × Ranks –6 Symbol Typ. I 810 DD0 I 930 DD1 I 400 DD2P I 270 DD2F I 180 DD2Q I 510 DD3P I 580 DD3N I 970 DD4R I 1010 DD4W I 300 DD5 I 16 DD6 I 1730 DD7 I 1) Module ...
Page 19
... Data-out high-impedance time HZ from CK/CK t Address and control input hold IH time t Control and Addr. input pulse IPW width (each input) Rev. 1.21, 2007-01 03292006-F1IB-1I3E Small Outline DDR SDRAM Modules AC Timing - Absolute Specifications for PC3200 and PC2700 –5 –6 DDR400B DDR333 Min. Max. Min. –0.5 +0.5 –0.7 0.45 ...
Page 20
... V ± 0.2 V (DDR333 2.6 V ± 0 DDQ stabilizes. REF t is equal to the actual system clock cycle time Internet Data Sheet HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules 1) Unit Note / Test Condition Max. — ns Fast slew 3)4)5)6)8) rate — ns Slow slew ...
Page 21
... DQSS 12) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system performance (bus turnaround) degrades accordingly. Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules 21 Internet Data Sheet ...
Page 22
... All values with XX in the table are module specific bytes which are defined during production. List of SPD Code Tables • Table 14 “SPD Codes for HYS64D64020HBDL–5–C and HYS64D64020GBDL–5–C” on Page 22 • Table 15 “SPD Codes for HYS64D64020HBDL–6–C and HYS64D64020GBDL–6–C” on Page 25 ...
Page 23
... Manufacturer’s JEDEC ID Code (5) 69 Manufacturer’s JEDEC ID Code (6) 70 Manufacturer’s JEDEC ID Code (7) Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules HYS64D64020GBDL–5–C HYS64D64020HBDL–5–C 512MB 512MB ×64 ×64 2 Ranks (×8) 2 Ranks (×8) PC3200S–30331 PC3200S– ...
Page 24
... Module Manufacturing Date Week Module Serial Number 99 - 127 Not used Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules HYS64D64020GBDL–5–C HYS64D64020HBDL–5–C 512MB 512MB ×64 ×64 2 Ranks (×8) 2 Ranks (×8) PC3200S–30331 PC3200S–30331 Rev ...
Page 25
... CL 26 SDRAM @ -1 [ns] AC max t 27 [ns] RPmin t 28 [ns] RRDmin t 29 [ns] RCDmin Rev. 1.21, 2007-01 03292006-F1IB-1I3E SPD Codes for HYS64D64020HBDL–6–C and HYS64D64020GBDL–6–C HYS64D64020GBDL–6–C 512MB ×64 2 Ranks (×8) PC2700S–25330 Rev. 0.0 HEX 2 PROM ...
Page 26
... Part Number, Char 5 78 Part Number, Char 6 79 Part Number, Char 7 Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules HYS64D64020GBDL–6–C HYS64D64020HBDL–6–C 512MB 512MB ×64 ×64 2 Ranks (×8) 2 Ranks (×8) PC2700S–25330 PC2700S–25330 Rev ...
Page 27
... Module Manufacturing Date Week Module Serial Number 99 - 127 Not used Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules HYS64D64020GBDL–6–C HYS64D64020HBDL–6–C 512MB 512MB ×64 ×64 2 Ranks (×8) 2 Ranks (×8) PC2700S–25330 PC2700S–25330 Rev ...
Page 28
... MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Rev. 1.21, 2007-01 03292006-F1IB-1I3E Package Outline SO-DIMM L-DIM-200-22 67.6 63.6 ±0.1 199 (2.45) 18.45 ±0.1 1.8 ±0.1 (2.4) 47.4 ±0.1 (2.7) (2.15) 1.5 ±0.1 200 0.45 ±0.03 28 Internet Data Sheet HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules FIGURE 2 3.8 MAX. 1 ±0.1 0.15 GLD09573 ...
Page 29
... Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.2 Current Specification and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4 SPD Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Rev. 1.21, 2007-01 03292006-F1IB-1I3E HYS64D64020[H/G]BDL–[5/6]–C Small Outline DDR SDRAM Modules 29 Internet Data Sheet ...
Page 30
... Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Qimonda Office. Qimonda Components may only be used in life-support devices or systems with the express written approval of Qimonda failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...