hcts244ms Intersil Corporation, hcts244ms Datasheet - Page 10

• Manufacturer Part Number: hcts244ms
• Description: Radiation Hardened Octal Buffer/line Driver, Three-state
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
108 x 106 mils
Type: Al/Sil
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS244 is TA14402A.
1A1 (4)
1A2 (6)
2Y2 (5)
2Y1 (7)
5
2
A/cm
Å
2
2.6k
Å
Å
2Y3
1k
(3)
Å
1A3
(8)
2Y0
(9)
1A0
(2)
HCTS244MS
GND
(10)
HCTS244MS
1OE
(1)
611
(11)
2A0
VCC
(20)
(12)
1Y3
2OE
(19)
(13)
2A1
Spec Number
(18) 1Y0
(17) 2A3
(16) 1Y1
(15) 2A2
(14) 1Y2
518616