hcts75ms Intersil Corporation, hcts75ms Datasheet - Page 8

• Manufacturer Part Number: hcts75ms
• Description: Radiation Hardened Dual 2-bit Bistable Transparent Latch
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
89 x 88 mils
2.25 x 2.24mm
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 x 4 mils
The mask series for the HCTS75 is TA14442A.
D1 1 (3)
VCC (5)
D0 2 (6)
D1 2 (7)
E 2 (4)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
D0 1
(2)
Q1 2
(8)
HCTS75MS
HCTS75MS
Q0 1
(1)
Q1 2
477
(9)
Q0 2
(10)
Q0 1
(16)
Spec Number
(15) 1 Q1
(14) 1 Q1
(13) 1 E
(12) GND
(11) 2 Q0
518625