hcts574ms Intersil Corporation, hcts574ms Datasheet - Page 10

• Manufacturer Part Number: hcts574ms
• Description: Radiation Hardened Octal D-type Flip-flop, Three-state, Positive Edge Triggered
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
101 x 85 mils
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS574 is TA14460A.
5
2
A/cm
Å
2
D1 (3)
D2 (4)
D3 (5)
D4 (6)
D5 (7)
D6 (8)
2.6k
Å
Å
1k
Å
(9)
D7
D0
(2)
GND
(10)
OE
HCTS574MS
(1)
HCTS574MS
703
VCC
(20)
(11)
CP
(19)
Q0
(12)
Q7
(18) Q1
(17) Q2
(16) Q3
(15) Q4
(14) Q5
(13) Q6
Spec Number
518629