mgfs39e2527a-01 Mitsumi Electronics, Corp., mgfs39e2527a-01 Datasheet - Page 20

• Manufacturer Part Number: mgfs39e2527a-01
• Description: 2.5-2.7ghz Hbt Integrated Circuit
• Manufacturer: Mitsumi Electronics, Corp.

Specifications are subject to change without notice.
HANDLING PRECAUTION
1) Work desk, test equipment, soldering iron and worker should be grounded before mounting and
2) The surface of a board on which this product is mounted should be as flat and clean as possible to
3)
4) Handling precaution at high temperature
5) Cleaning condition
6) After soldering, please remove the flux. Please take care that solvent does not penetrate into this
7) GaAs HBT contains As(Arsenic). This product should be dumped as particular industrial waste.
Recommended IR reflow soldering condition is shown as follows. (Max. two times)
testing. Please note that electric discharge of GaAs HBT is much more sensitive than that of Si
transistor. Handling without ground possibly damages GaAs HBT.
prevent a substrate from cracking by bending this product.
In case
Please note that crack, flaw or modification may be generated if epoxy resin part is handled with
tweezer
Please select after confirming administrative guidance, legal restrictions, and the mass of the residual
ion contaminant etc., and use it.
product.
s and etc. at high temperature.
of heating this product, please keep the same heat profile as recommended reflow one.
MITSUBISHI ELECTRIC CORP.
(PKG Surface temp.)
180 ±
120 ±
240deg.C
225deg.C
(20/20)
10
20sec
deg
C .
Max. Ramp Down Rate
Max. Ramp Up Rate
Peak 245deg.C
≤
≤
10
70
2.5-2.7GHz HBT Integrated Circuit
sec
sec
MGFS39E2527A-01
MITSUBISHI SEMICONDUCTOR
≤
≤
3deg./sec.
6deg./sec.
Sep. 30-2009
Rev. 1.0