upa1701 Renesas Electronics Corporation., upa1701 Datasheet

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upa1701

Manufacturer Part Number
upa1701
Description
Switching N-channel Power Mos Fet Industrial Use
Manufacturer
Renesas Electronics Corporation.
Datasheet

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upa1701AG
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Document No. G10929EJ2V0DS00 (2nd edition)
Date Published April 1996 P
Printed in Japan
DESCRIPTION
designed for power management applications of note
book computers, and Li-ion battery applications.
FEATURES
ABSOLUTE MAXIMUM RATINGS (T
this device actually used, an additional protection circuit is externally required if voltage exceeding the rated voltage
may be applied to this device.
This product is N-Channel MOS Field Effect Transistor
• 2.5 V Gate Drive and Low On-Resistance
• Low C
• Built-in G-S Protection Diode
• Small and Surface Mount Package
Drain to Source Voltage
Gate to Source Voltage
Drain Current (DC)
Drain Current (pulse)*
Total Power Dissipation (T
Channel Temperature
Storage Temperature
* PW
** Mounted on ceramic substrate of 1200 mm
The diode connected between the gate and source of the transistor serves as a protector against ESD. When
R
R
(Power SOP8)
DS(on)1
DS(on)2
SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE
10 s, Duty Cycle
iss
= 27 m
= 40 m
C
iss
= 1200 pF Typ.
Max. (V
Max. (V
The information in this document is subject to change without notice.
a
GS
GS
= 25 C)**
1 %
= 4.0 V, I
= 2.5 V, I
DATA SHEET
A
D
D
= 25 C, All terminals are connected)
= 3.5 A)
= 3.5 A)
I
D(pulse)
I
V
V
D(DC)
T
T
MOS Field Effect Power Transistors
P
DSS
GSS
2
stg
ch
T
0.7 mm
–55 ~ +150
150
2.0
20
7.0
12
28
1
8
5.37 Max
0.40
1.27
+0.10
_ 0.05
4
5
0.78 Max
W
V
V
A
A
C
C
PACKAGE DIMENSIONS
0.12 M
(in millimeter)
1,2,3
4
5,6,7,8 ; Drain
Gate Protection
Diode
Gate
0.5 – 0.2
PA1701
6.0 – 0.3
4.4
; Source
; Gate
©
Source
Drain
0.8
Body
Diode
0.10
1995

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upa1701 Summary of contents

Page 1

SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE DESCRIPTION This product is N-Channel MOS Field Effect Transistor designed for power management applications of note book computers, and Li-ion battery applications. FEATURES • 2.5 V Gate Drive and Low On-Resistance R = ...

Page 2

ELECTRICAL CHARACTERISTICS (T CHARACTERISTICS SYMBOL Drain to Source R DS(on)1 On-state Resistance R DS(on)2 Gate to Source Cutoff Voltage V GS(off) Forward Transfer Admittance | y fs Drain Leakage Current I DSS Gate to Source Leakage Current I GSS Input ...

Page 3

DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 100 100 120 140 160 T - Ambient Temperature - °C A FORWARD BIAS SAFE OPERATING AREA 100 Mounted on ceramic substrate of ...

Page 4

TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1 000 100 10 1 0.1 0.01 0.001 10 100 FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT 100 °C Pulsed A 25 °C 75 °C 125 ° 0.1 ...

Page 5

DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE 100 T - Channel Temperature -°C CH CAPACITANCE vs. ...

Page 6

REFERENCE Document Name NEC semiconductor device reliability/quality control system Quality grade on NEC semiconductor devices Semiconductor device mounting technology manual Semiconductor device package manual Guide to quality assurance for semiconductor devices Semiconductor selection guide Power MOS FET features and application ...

Page 7

...

Page 8

No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC ...

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