upg139gv Renesas Electronics Corporation., upg139gv Datasheet - Page 6

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upg139gv

Manufacturer Part Number
upg139gv
Description
L-band Dpdt Mmic Switch
Manufacturer
Renesas Electronics Corporation.
Datasheet
RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with our sales representatives.
6
Infrared Ray Reflow
VPS
Wave Soldering
Partial Heating Method
Note Exposure limit before soldering after dry-pack package is opened.
Caution Do not apply more than a single process at once, except for “partial heating method”.
This product should be soldered in the following recommended conditions. Other soldering methods and
Soldering process
Storage conditions: 25°C and relative humidity at 65% or less.
Peak package’s surface temperature: 235° C or below
Reflow time: 30 seconds or less (at 210° C)
Number of reflow process: 3, Exposure limit
Peak package’s surface temperature: 215° C or below
Reflow time: 40 seconds or less (at 200° C)
Number of reflow process: 3, Exposure limit
Solder temperature: 260° C or below
Flow time: 10 seconds or less
Number of flow process: 1, Exposure limit
Terminal temperature: 300° C
Flow time: 3 seconds or less (per one pin),
Exposure limit
Note
: None
Soldering Conditions
Note
Note
Note
: None
: None
: None
WS60-00-1
VP15-00-3
IR35-00-3
Symbol
PG139GV

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