upg103b Renesas Electronics Corporation., upg103b Datasheet - Page 6

• Manufacturer Part Number: upg103b
• Description: Wide-band Amplifier
• Manufacturer: Renesas Electronics Corporation.

RECOMMENDED SOLDERING CONDITIONS
different conditions.
TYPES OF SURFACE MOUNT DEVICE
(C10535EJ7V0IF00).
6
Infrared ray reflow
Partial heating method
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
PRECAUTION This IC must be handled with great care to prevent static discharge because its circuitry is
*
Note Do not apply more than a single process at once, except for “Partial heating method”.
PG103B
Soldering process
The Grate Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the Japanese law concerned.
Keep the Japanese law concerned and so on, especially in case of removal.
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 ˚C and relative humidity at 65 % or less.
composed of GaAs MES FET.
Peak package’s surface temperature: 230 ˚C or below,
Reflow time: 10 seconds or below (210 ˚C or higher),
Number of reflow process: 1, Exposure limit * : None
Terminal temperature: 260 ˚C or below,
Flow time: 10 seconds or below,
Exposure limit * : None
Caution
Soldering conditions
Symbol
PG103B