HFA15TB60-1P VISHAY [Vishay Siliconix], HFA15TB60-1P Datasheet - Page 8
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HFA15TB60-1P
Manufacturer Part Number
HFA15TB60-1P
Description
HEXFRED, Ultrafast Soft Recovery Diode, 15 A
Manufacturer
VISHAY [Vishay Siliconix]
Datasheet
1.HFA15TB60-1P.pdf
(9 pages)
DIMENSIONS in millimeters and inches
Notes
(1)
(2)
(3)
Document Number: 95419
Revision: 04-Oct-10
Dimensioning and tolerancing as per ASME Y14.5M-1994
Dimension D and E do not include mold flash. Mold flash shall
not exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
Thermal pad contour optional within dimension E, L1, D1 and E1
SYMBOL
A1
b1
b2
b3
D1
E1
c1
c2
L1
L2
D
A
b
E
L
c
e
Modified JEDEC outline TO-262
(3)
(Datum A)
L1
D
DiodesAmericas@vishay.com, DiodesAsia@vishay.com,
0.010
L2
Lead tip
For technical questions within your region, please contact one of the following:
13.46
MIN.
4.06
2.03
0.51
0.51
1.14
1.14
0.38
0.38
1.14
8.51
6.86
9.65
7.90
3.56
B
2 x e
M
-
1
A
(2) (3)
B
M
MILLIMETERS
E
B
2
C
2.54 BSC
3
C
3 x b
3 x b2
A
L
(2)
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
MAX.
10.67
14.10
4.83
3.02
0.99
0.89
1.78
1.73
0.74
0.58
1.65
9.65
8.00
8.80
1.65
3.71
TO-262
c
A
A1
c2
(4)
(5)
(6)
Seating
Dimension b1 and c1 apply to base metal only
Controlling dimension: inches
Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline
plane
A
A
B
0.160
0.080
0.020
0.020
0.045
0.045
0.015
0.015
0.045
0.335
0.270
0.380
0.311
0.530
0.140
MIN.
-
DiodesEurope@vishay.com
0.100 BSC
INCHES
Plating
c
Section B - B and C - C
Section A - A
Scale: None
Outline Dimensions
Vishay Semiconductors
b1, b3
(b, b2)
E1
E
(4)
MAX.
0.190
0.119
0.039
0.035
0.070
0.068
0.029
0.023
0.065
0.380
0.315
0.420
0.346
0.555
0.065
0.146
D1
c1
(3)
Base
metal
(4)
(3)
www.vishay.com
NOTES
2, 3
4
4
4
2
3
3
3
1