TSS461CVAN TEMIC [TEMIC Semiconductors], TSS461CVAN Datasheet
TSS461CVAN
Related parts for TSS461CVAN
TSS461CVAN Summary of contents
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TSS463 VAN Van Controller Serial Interface TSS461C VAN Van Controller TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 TSS463/TSS461C VAN Controllers 1999 January Qualpack TSS463 / TSS461C 1 ...
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Qualpack TS80C31X2/C32X2 1. Contents 1. Contents........................................................................................................................................................ 2 2. General Information ..................................................................................................................................... 3 3. Technology Information .............................................................................................................................. 4 3 AFER ROCESS ECHNOLOGY 3 .......................................................................................................................................... 5 RODUCT ESIGN 3 ................................................................................................................................. 6 ACKAGE ECHNOLOGY 3.3.1 SOIC.300 ...
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General Information Product Name: Function: Specific features: Wafer process: Available plastic package types: Locations: Process, product development Wafer plant QC responsability Assembly Probe test Final test Quality Assurance Reliability testing Failure analysis Quality Assurance Management Nantes Signed.......................................................... Rev. 2 ...
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Qualpack TS80C31X2/C32X2 3. Technology Information 3.1 Wafer Process Technology Process type (Name): Base material: Wafer Thickness (final) Wafer diameter Number of masks Gate oxide Material Thickness Polysilicon Number of layers Thickness Metal Number of layers Layer 1 material Layer 1 ...
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Product Design Die size (TSS463) Die size (TSS461C) Logic Effective channel length Gate poly width Gate poly spacing Metal 1 width Metal 1 spacing Metal 2 width Metal 2 spacing Contact size Via size Rev. 2 – January 1999 ...
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Qualpack TS80C31X2/C32X2 3.3 Package Technology 3.3.1 SOIC.300 16 leads Package weight Chip separation method Lead frame Material Thickness Size Lead plating Die attach Material Type Wire bonding Material Diameter Method Molding Material Flammability rating Marking Method Coding example Dry packing ...
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Tape packed Primary Material Number per unit Secondary Material Number per unit Labelling (minimum) Bar coding 3.3.2 Other available packages No other package available Dry packing SOIC 16 SOIC 24 3.4 Test Probe equipement Probe temperature Test equipement Test temperature ...
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Qualpack TS80C31X2/C32X2 3.5 Device Cross Section NMOS Epi Substrate Thin Oxide Polysilicon PMOS Transversal Isolation Oxide Planararization Metal Passivation Metal 2 Rev. 2 – January 1999 ...
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Wafer Process Control All the inspections and controls are defined as a process step in the production management software, and are led by using a centralized SPC software. PC system could be summarized as follows: Physical Critical process parameters ...
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Qualpack TS80C31X2/C32X2 4. Qualification Wafer Process Qualification All product qualifications are split into three distinct steps as shown above. This same procedure is also used to qualify a change. Before a product is released for use, it must have been ...
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Change Procedure All changes are controlled by ECN (Engineering Change Notice). All major changes are notified to those customers using products which are affected by the change. A major change is defined as a change which affects the electrical ...
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Qualpack TS80C31X2/C32X2 4.2 Qualification Flow General Requirements for Plastic packaged CMOS IC Standard MIL-STD 883D Electrical Life Test (Early Failure Rate) Method 1005 MIL-STD 883D Electrical Life Test (Latent Failure Rate) Method 1005 1000 hours 150°C 5.75V Dynamic or Static ...
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Wafer Process Qualification This section summarizes the global 1998 reliability results of the products manufactured with the same technology as the VAN TSS463 and TSS461C (Z86 processes). Wafer Device Types Test Description Process Z86 Microcontrollers EFR Dynamic Life Test ...
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Qualpack TS80C31X2/C32X2 4.4 Package Qualification This section presents TSS463 and TSS461C package qualification results, including additional measurements intending to fulfil Q100 Automotive Standard requirements. Lot Device Type Test Description Number Z21538F TSS463 Thermal Cycles (1) 85/85 Humidity ...
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Lot Device Type Test Description Number Z20569K HMT-65664A Thermal Cycles (2) 85/85 Humidity Resistance to Soldeting Heat Marking Permanency HAST after Soldering Stress (with 5.5v bias) Global All products Mounting Stress level 1 Climatic Tests Notes: (1) ...
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Qualpack TS80C31X2/C32X2 4.5 Device Qualification This section presents TSS463 and TSS461C device qualification results, including additional measurements intending to fulfil Q100 Automotive Standard requirements. Lot Device Type Test Description Number Z21538F TSS463 EFR Dynamic Life Test LFR ...
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ESD and Latch-up results Lot Device Type Test Description Number Z21538B TSS463 ESD HBM model SO 16 ESD CDM model Latch up Vcc overstress LU power injection Z19814 TSS461C ESD HBM model DIL 24.3 ESD CDM model TSS461C Latch ...
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Qualpack TS80C31X2/C32X2 Outgoing Quality and Reliability 4.5.4 AOQ (Average Outgoing Quality) The AOQ is measured following 100% test by sampling outgoing product. The results of this inspection are recorded in ppm (parts per million) using the method defined in JEDEC ...
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EFR (Early Failure Rate) The EFR is measured on a sample of devices by operating them at an elevated temperature and measuring the number which fails to meet specification after 12 hours at 150°C. The figure is expressed in ...
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Qualpack TS80C31X2/C32X2 5. User Information 5.1 Soldering Recommendations For DRY PACKED products, hereunder: - Dry packed products must not be stored more than 1 year at 40°c - 90%rh (worst storage conditions assumed longer storage period is allowed ...
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Environmental Information T The EMIC Environmental Policy aims at: - Reducing the use of harmful chemicals in its processes - Reducing the content of harmful materials in its products - Using re-cyclable materials wherever possible - Reducing the energy ...
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Qualpack TS80C31X2/C32X2 7. Other Data 7.1 ISO9001 Approval Certificate 22 Rev. 2 – January 1999 ...
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Databook Reference Direct access on the web to datasheet at: http://www.temic-semi.com Select: Products Automotive ICs Multiplex ICs 7.3 Address Reference All enquiries relating to this document should be addressed to the following: TEMIC Semiconductors BP70602 44306 Nantes Cedex 3 ...
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Qualpack TS80C31X2/C32X2 8. Revision History Issue Modification Notice 0 TSS463 VAN Qualification Report 1 Qualpack TSS463 Van 2 Qualpack TSS463 and TSS461C VAN CONTROLLERS 1999 January Remarks: The information given in this document is believed to be accurate and reliable. ...