TSS461CVAN TEMIC [TEMIC Semiconductors], TSS461CVAN Datasheet - Page 6

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TSS461CVAN

Manufacturer Part Number
TSS461CVAN
Description
Van Controller Serial Interface
Manufacturer
TEMIC [TEMIC Semiconductors]
Datasheet
Qualpack TS80C31X2/C32X2
3.3 Package Technology
3.3.1 SOIC.300 16 leads
Package weight
Chip separation method
Lead frame
Die attach
Wire bonding
Molding
Marking
Dry packing
Tube packed
6
Material
Thickness
Size
Lead plating
Material
Type
Material
Diameter
Method
Material
Flammability rating
Method
Coding example
Primary
Material
Number per unit
Secondary
Material
Number per unit
Labelling (minimum)
Bar coding
0,43 g
Cu
10 mils
270*270 mils 2
Electroplated Sn/Pb 85/15
Silver epoxy
Ablestick 84-1 LMISR4
Gold
33um
Thermosonic
Nitto MP8000AN
UL94V-0
Printed ink
TEMIC
optional special customer marking
TSS463
YY MM
No
Tube
Antistatic PVC
47
Box
Cardboard
1692
Device type, Quantity, Date Code, Prod. code
Code 39 to EIA-556-A
Sawing
Rev. 2 – January 1999

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