mx25l1635dzni-10g Macronix International Co., mx25l1635dzni-10g Datasheet - Page 3

• Manufacturer Part Number: mx25l1635dzni-10g
• Description: Serial Flash Memory
• Manufacturer: Macronix International Co.

P/N: PM1374
POWER-ON STATE ................................................................................................................................................... 26
ELECTRICAL SPECIFICATIONS .............................................................................................................................. 27
Timing Analysis ........................................................................................................................................................ 31
Table 7. ID Definitions ............................................................................................................................................ 24
(19) Enter Secured OTP (ENSO) ........................................................................................................................... 24
(20) Exit Secured OTP (EXSO) .............................................................................................................................. 24
(21) Read Security Register (RDSCUR) ................................................................................................................. 25
Table 8. Security Register Definition ....................................................................................................................... 25
(22) Write Security Register (WRSCUR) ................................................................................................................ 25
ABSOLUTE MAXIMUM RATINGS ......................................................................................................................... 27
Figure 2. Maximum Negative Overshoot Waveform ............................................................................................... 27
CAPACITANCE TA = 25°C, f = 1.0 MHz ................................................................................................................. 27
Figure 3. Maximum Positive Overshoot Waveform ................................................................................................. 27
Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL .................................................................. 28
Figure 5. OUTPUT LOADING ................................................................................................................................ 28
Table 9. DC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V) ....... 29
Table 10. AC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V) ..... 30
Figure 6. Serial Input Timing ................................................................................................................................... 31
Figure 7. Output Timing .......................................................................................................................................... 31
Figure 8. WP# Setup Timing and Hold Timing during WRSR when SRWD=1 ....................................................... 32
Figure 9. Write Enable (WREN) Sequence (Command 06) ................................................................................... 32
Figure 10. Write Disable (WRDI) Sequence (Command 04) .................................................................................. 32
Figure 11. Read Identification (RDID) Sequence (Command 9F) .......................................................................... 33
Figure 12. Read Status Register (RDSR) Sequence (Command 05) ..................................................................... 33
Figure 13. Write Status Register (WRSR) Sequence (Command 01) ................................................................... 33
Figure 14. Read Data Bytes (READ) Sequence (Command 03) ........................................................................... 34
Figure 15. Read at Higher Speed (FAST_READ) Sequence (Command 0B) ....................................................... 34
Figure 16. 2 x I/O Read Mode Sequence (Command BB) ..................................................................................... 35
Figure 17. 4 x I/O Read Mode Sequence (Command EB) ..................................................................................... 35
Figure 18. 4 x I/O Read enhance performance Mode Sequence (Command EB) ................................................. 36
Figure 19. Page Program (PP) Sequence (Command 02) .................................................................................... 37
Figure 20. 4 x I/O Page Program (4PP) Sequence (Command 38) ...................................................................... 37
Figure 21. Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) ....................... 38
Figure 22. Sector Erase (SE) Sequence (Command 20) ...................................................................................... 38
Figure 23. Block Erase (BE) Sequence (Command D8) ....................................................................................... 38
Figure 24. Chip Erase (CE) Sequence (Command 60 or C7) ............................................................................... 39
Figure 25. Deep Power-down (DP) Sequence (Command B9) ............................................................................. 39
Figure 26. Release from Deep Power-down and Read Electronic Signature (RES) Sequence (Command AB) .. 39
Figure 27. Release from Deep Power-down (RDP) Sequence (Command AB) .................................................... 40
Figure 28. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90 or EF or DF) .............. 40
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MX25L1635D
REV. 1.7, MAR. 30, 2009