UPD70F3102-33 NEC [NEC], UPD70F3102-33 Datasheet - Page 6
UPD70F3102-33
Manufacturer Part Number
UPD70F3102-33
Description
32-/16-BIT SINGLE-CHIP MICROCONTROLLER
Manufacturer
NEC [NEC]
Datasheet
1.UPD70F3102-33.pdf
(82 pages)
- Current page: 6 of 82
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1. DIFFERENCES AMONG PRODUCTS
1.1 Differences Between PD70F3102-33 and PD703102-33
1.2 Differences Between PD70F3102-33 and PD70F3102A-33
6
Item
Internal ROM
Flash memory programming pin
Flash memory programming mode
Electrical specifications
Others
Item
HV
Electrical specifications
Package
Cautions 1. There are differences in noise immunity and noise radiation between the flash memory
DD
2. When switching from the flash memory version to the mask ROM version, write the same
Product
version and mask ROM version. When pre-producing an application set with the flash
memory version and then mass-producing it with the mask ROM version, be sure to conduct
sufficient evaluation for commercial samples (not engineering samples) of the mask ROM
version.
code to the free area of the internal ROM.
4.5 to 5.5 V
See individual data sheets.
• 144-pin plastic LQFP (fine pitch) (20
Product
Flash memory
Provided (V
Provided (MODE0 = L, MODE1 = H,
MODE2 = L, MODE3/V
Consumption current etc. differ (see individual data sheets).
Circuit scale and master layout differ, thus noise immunity, noise radiation, etc. differ.
PD70F3102-33
Preliminary Data Sheet U13844EJ2V0DS00
PP
PD70F3102-33
)
PP
20)
= 7.8 V)
3.0 to 3.6 V
• 157-pin plastic FBGA (14
• 144-pin plastic LQFP (fine pitch) (20
Mask ROM
None
None
PD70F3102A-33
PD703102-33
14)
PD70F3102-33
20)
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