bc41b143a07 ETC-unknow, bc41b143a07 Datasheet - Page 90

• Manufacturer Part Number: bc41b143a07
• Description: Single Chip Bluetooth
• Manufacturer: ETC-unknow

13 Solder Profiles
The soldering profile depends on various parameters necessitating a set up for each application. The data here is
given only for guidance on solder re-flow. There are four zones:
13.1
Composition of the solder ball:Sn 95.5%, Ag 4.0%, Cu 0.5%
Key features of the profile:
Devices will withstand the specified profile.
Lead-free devices will withstand up to three reflows to a maximum temperature of 260°C.
CS-101564-DSP12
1.
2.
3.
4.
Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5°C/s.
Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the flux. The
duration in this zone (typically 2-3 minutes) will need to be adjusted to optimise the out gassing of the flux.
Reflow Zone - The peak temperature should be high enough to achieve good wetting but not so high as to
cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which
can result in a brittle joint.
Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give a longer lasting
joint. Typical rates will be 2-5°C/s.
Initial Ramp = 1-2.5°C/sec to 175°C±25°C equilibrium
Equilibrium time = 60 to 180 seconds
Ramp to Maximum temperature (245°C) = 3°C/sec max.
Time above liquidus temperature (217°C): 45-90 seconds
Device absolute maximum reflow temperature: 260°C
Typical Solder Re-flow Profile for Devices with Lead-Free Solder Balls
300
250
200
150
100
50
0
0
50
Figure 13.1: Typical Lead-Free Re-flow Solder Profile
100
150
Production Information
© CSR plc 2003-2007
Typical Lead-Free Reflow
200
Solder Profile
Time
250
(s)
300
350
400
450
500
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Solder Profiles