tim3742-8sl TOSHIBA Semiconductor CORPORATION, tim3742-8sl Datasheet
tim3742-8sl
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tim3742-8sl Summary of contents
Page 1
... 3. GSoff 30mA DSS -100μA GSO GS R Channel to Case th(c-c) TIM3742-8SL UNIT MIN. TYP. MAX. dBm 38.5 39.5 dB 9.0 10.0 ⎯ A 2.2 ⎯ ⎯ dB ⎯ dBc -42 -45 ⎯ A 2.2 ° C ⎯ ⎯ UNIT MIN. TYP. MAX. ⎯ mS 1800 V -1 ...
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... Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 ° C) Channel Temperature Storage Temperature PACKAGE OUTLINE (2-11D1B) HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260°C. TIM3742-8SL SYMBOL UNIT ...
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... RF PERFORMANCE Output Power (Pout) vs. Frequency V =10V DS ≅2. Pin=29.5dBm 3.7 Output Power(Pout) vs. Input Power(Pin) 42 freq.=4.2GHz 41 V =10V DS ≅2. TIM3742-8SL 3.8 3.9 4.0 4.1 Frequency (GHz) Pout ηadd 26 28 Pin(dBm ...
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... Power Dissipation vs. Case Temperature IM3 vs. Output Power Characteristics -10 V =10V DS ≅2. freq.=4.2GHz -20 Δf=5MHz -30 -40 -50 - Pout (dBm) @Single carrier level TIM3742-8SL 80 120 160 Tc (° 200 32 34 ...