BD4156MUV_09 ROHM [Rohm], BD4156MUV_09 Datasheet - Page 17

• Manufacturer Part Number: BD4156MUV_09
• Description: Power Switch for ExpressCardTM
• Manufacturer: ROHM [Rohm]

●APPLICATION CIRCUIT (CIRCUIT for ExpressCard
●Heat loss
○
BD4156MUV
c
www.rohm.com
<Reference value>
①Chip junction temperature Tj is calculated
2009 ROHM Co., Ltd. All rights reserved.
Thermal design should allow the device to operate within the following conditions. Note that the temperatures listed are the
allowed temperature limits. Thermal design should allow sufficient margin from these limits.
Chip junction temperature Tj can be determined as follows:
Most of heat loss in the BD4156MUV occurs at the output switch. The power lost is determined by multiplying the
on-resistance by the square of output current of each switch.
from IC surface temperature TC under
actual application conditions:
Tj=TC+θj-c×W
1. Ambient temperature Ta can be no higher than 100°C.
2. Chip junction temperature Tj can be no higher more than 150°C.
θj-c:VQFN020V4040
CPUSB#(2)
PERST#(6)
3.3Vaux(4)
CPPE#(1)
3.3V(3)
1.5V(5)
CPPE#(10pin)
CPUSB#(9pin)
V3(3,5pin)
V3AUX(15pin)
V15(11,13pin)
PERST#(8pin)
TEST(16pin)
**℃/W
θj-a:VQFN020V4040
②Chip junction temperature Tj is calculated from ambient temperature Ta:
TM
BD4156MUV
Tj=TC+θj-a×W
Compliance Checklist)
<Reference value>
GND(7pin)
17/23
Substrate size 70×70×1.6mm
PERST_IN#(6pin)
V3AUX_IN(17pin)
V15_IN(12,14pin)
RCLKEN(18pin)
(substrate surface copper foil area: less than 3%)
V3_IN(2,4pin)
SYSR(1pin)
EN(20pin)
**℃/W Single-layer substrate
**℃/W
(IC only)
3
(thermal vias in the board.)
Technical Note
2009.05 - Rev.A
3.3V(7)
3.3Vaux(8)
1.5V(9)
SysReset#(10)