LTC2634-HMI10 LINER [Linear Technology], LTC2634-HMI10 Datasheet - Page 27

• Manufacturer Part Number: LTC2634-HMI10
• Manufacturer: LINER [Linear Technology]

PACKAGE DESCRIPTION
3.50 0.05
2.10 0.05
1.45 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
3.00 0.10
(4 SIDES)
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.50 BSC
0.25 0.05
0.70 0.05
PACKAGE OUTLINE
0.75 0.05
UD Package
1.45 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
0.50 BSC
0.25 0.05
1
2
(UD16) QFN 0904
0.40 0.10
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 45 CHAMFER
LTC2634
27
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