APA3541 Etc, APA3541 Datasheet - Page 11

• Manufacturer Part Number: APA3541
• Description: Class AB Stereo Headphone Driver with Mute
• Manufacturer: Etc

APA3541/4
Physical Specifications
Reflow Condition
Reference JEDEC Standard J-STD-020A APRIL 1999
Copyright
Rev. B.1 -Apr., 2003
Terminal Material
Lead Solderability
Classification Reflow Profiles
Average ramp-up rate(183 C to Peak)
Preheat temperature 125 ± 25 C)
Temperature maintained above 183 C
Time within 5 C of actual peak temperature 10 –20 seconds
Peak temperature range
Ramp-down rate
Time 25 C to peak temperature
Package Reflow Conditions
pkg. thickness
and all bgas
Convection 220 +5/-0 C
VPR 215-219 C
IR/Convection 220 +5/-0 C
ANPEC Electronics Corp.
Pre-heat temperature
2.5mm
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
pkg. thickness < 2.5mm and
pkg. volume
(IR/Convection or VPR Reflow)
3 C/second max.
120 seconds max
60 – 150 seconds
220 +5/-0 C or 235 +5/-0 C 215-219 C or 235 +5/-0 C
6 C /second max.
6 minutes max.
350 mm³
183 C
11
Convection or IR/
Convection
pkg. thickness < 2.5mm and pkg.
volume < 350mm³
Convection 235 +5/-0 C
VPR 235 +5/-0 C
IR/Convection 235 +5/-0 C
Peak temperature
10 C /second max.
60 seconds
10 C /second max.
www.anpec.com.tw
VPR
Time