AD8009-EB Analog Devices, AD8009-EB Datasheet - Page 3

• Manufacturer Part Number: AD8009-EB
• Description: 1 GHz/ 5/500 V/us Low Distortion Amplifier
• Manufacturer: Analog Devices

ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12.6 V
Internal Power Dissipation
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . ± 3.5 V
Output Short Circuit Duration
Storage Temperature Range R Package . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
NOTES
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8009 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. B
Model
AD8009AR
AD8009AR-REEL
AD8009ART
AD8009ART-REEL
AD8009ART-REEL7
AD8009-EB
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Specification is for device in free air:
8-Lead SOIC Package: θ
Small Outline Package (R) . . . . . . . . . . . . . . . . . 0.75 Watts
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
JA
= 155°C/W.
2
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Temperature
Range
–40°C to +85°C
–40°C to +85°C
1
ORDERING GUIDE
Package
Description
8-Lead SOIC
13" Tape and Reel
5-Lead SOT-23
13" Tape and Reel
7" Tape and Reel
Evaluation Board
S
–3–
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8009 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition
temperature of the plastic, approximately +150°C. Exceeding
this limit temporarily may cause a shift in parametric perfor-
mance due to a change in the stresses exerted on the die by the
package. Exceeding a junction temperature of +175°C for an
extended period can result in device failure.
While the AD8009 is internally short circuit protected, this
may not be sufficient to guarantee that the maximum junction
temperature (+150°C) is not exceeded under all conditions.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature
2.0
1.5
1.0
0.5
0
–50
–40 –30 –20 –10
8-LEAD SOIC PACKAGE
5-LEAD SOT-23 PACKAGE
AMBIENT TEMPERATURE – °C
0
Package
Option
SO-8
SO-8
RT-5
RT-5
RT-5
SO-8
10
20
30
WARNING!
40
50
T
J
60
= +150°C
ESD SENSITIVE DEVICE
70
AD8009
80
Branding
Information
HKJ
HKJ
HKJ
90