PCF8576C Philips Semiconductors, PCF8576C Datasheet - Page 35

• Manufacturer Part Number: PCF8576C
• Description: Universal LCD driver for low multiplex rates
• Manufacturer: Philips Semiconductors

Philips Semiconductors
12.1
In chip-on-glass technology, where driver devices are
bonded directly onto glass of the LCD, it is important that
the devices may be cascaded without the crossing of
conductors, but the paths of conductors can be continued
on the glass under the chip. All of this is facilitated by the
PCF8576C bonding pad layout (Fig.30). Pads needing bus
interconnection between all PCF8576Cs of the cascade
are V
lines may be led to the corresponding pads of the next
PCF8576C through the wide opening between V
and the backplane output pads.
13 BONDING PAD LOCATIONS
1998 Jul 30
Universal LCD driver for low multiplex
rates
Chip dimensions: approximately 2.92
Pad area: 0.0121 mm
Bonding pad dimensions: 110
DD
Chip-on-glass cascadability in single plane
, V
SS
, V
LCD
, CLK, SCL, SDA and SYNC. These
2
.
3.20
mm
110 m.
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
S33
3.20 mm.
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
34
51
33
52
Fig.30 Bonding pad locations.
32
53
LCD
31
54
pad
30
55
x
29
56
PCF8576C
35
0
2.92 mm
28
1
y
The only bus line that does not require a second opening
to lead through to the next PCF8576C is V
cascade centre. The placing of V
allows the two supplies to be tied together.
When an external clocking source is to be used, OSC of all
devices should be tied to V
and SA0 have been placed between V
facilitate wiring of oscillator, hardware subaddress and
slave address.
0
27
2
26
3
25
4
24
23
5
22
6
21
7
DD
20
19
18
17
16
15
14
13
12
11
10
9
8
. The pads OSC, A0, A1, A2
S3
S2
S1
S0
BP3
BP1
BP2
BP0
V
V
SA0
A2
A1
SS
LCD
LCD
MBE536
Product specification
adjacent to V
PCF8576C
SS
and V
LCD
, being the
DD
SS
to