LTC4059 LINER [Linear Technology], LTC4059 Datasheet - Page 11

• Manufacturer Part Number: LTC4059
• Manufacturer: LINER [Linear Technology]

PACKAGE DESCRIPTIO
2.50 0.05
1.15 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
0.61 0.05
(2 SIDES)
1.42 0.05
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50 BSC
U
0.25 0.05
0.675 0.05
PACKAGE
OUTLINE
6-Lead Plastic DFN (2mm 2mm)
(Reference LTC DWG # 05-08-1703)
(SEE NOTE 5)
TOP MARK
PIN 1
DC Package
0.200 REF
0.75 0.05
2.00 0.10
(4 SIDES)
LTC4059/LTC4059A
0.00 – 0.05
0.56 0.05
(2 SIDES)
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
1.37 0.05
(2 SIDES)
3
4
6
1
0.50 BSC
0.38 0.05
0.25 0.05
(DC6) DFN 0403
PIN 1
NOTCH
11
4059fa