UPC8100GR NEC [NEC], UPC8100GR Datasheet

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UPC8100GR

Manufacturer Part Number
UPC8100GR
Description
SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS
Manufacturer
NEC [NEC]
Datasheet

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Document No. P10817EJ3V0DS00 (3rd edition)
Date Published October 1999 N CP(K)
Printed in Japan
DESCRIPTION
communications, mainly CT2. This IC consists of upconverter and downconverter, which are packaged in 20 pin SSOP.
Quadrature modulator IC ( PC8101GR) is also available as for kit-use with this IC. So, these pair devices contribute to
make RF block small, high-performance and low power-consumption.
passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion
and migration. Thus, this product has excellent performance, uniformity and reliability.
FEATURES
• Operating frequency – f
• Upconverter and downconverter are integrated in 1 chip.
• 20 pin SSOP suitable for high-density surface mounting.
• Wide operating voltage V
• Equipped with Power Save Function.
• Excellent linearity
APPLICATIONS
• Typical application – Digital cordless phone CT2.
• Further application – Digital cellular, etc.
ORDERING INFORMATION
PART NUMBER
This product is manufactured using NEC’s 20 GHz f
PC8100GR-E2
Remark To order evaluation samples, please contact your local NEC sales office. (Order number: PC8100GR)
PC8100GR is a silicon monolithic integrated circuit designed as up/down converters for 800 MHz to 900 MHz mobile
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS
20 pin plastic SSOP
RF
PACKAGE
(225 mil)
CC
= 800 MHz to 900 MHz, f
= 2.7 to 4.5 V
SILICON UP/DOWN CONVERTERS IC
Caution electro-static sensitive devices
BIPOLAR ANALOG INTEGRATED CIRCUIT
Embossed tape 12 mm wide. QTY 2.5 kp/Reel.
Pin 1 indicates roll-in direction of tape.
The mark
DATA SHEET
T
NESAT
IF
shows major revised points.
= 50 MHz to 150 MHz, f
SUPPLYING FORM
III
silicon bipolar process. This process uses silicon nitride
Lo
= 650 MHz to 1 050 MHz
PC8100GR
©
1995,1999

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UPC8100GR Summary of contents

Page 1

SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS DESCRIPTION PC8100GR is a silicon monolithic integrated circuit designed as up/down converters for 800 MHz to 900 MHz mobile communications, mainly CT2. This IC consists of upconverter and ...

Page 2

INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS REG. REG GND 2. RF BYPASS 3. RF INPUT 4. PEAKING OUT 5. P/S (for ...

Page 3

PIN EXPLANATION PIN APPLIED PIN VOLTAGE ASSIGNMENT NO. VOLTAGE (V) 1 GND 0 bypass – input – 4 Peaking out – 0.12 5 Power-save pin 0 to 4.5 for downconverter 6 Power-save pin 0 to 4.5 ...

Page 4

PIN EXPLANATION PIN PIN VOLTAGE ASSIGNMENT NO. (V) 10 MIX OUT 1 2.3 11 MIX OUT 2 2.3 12 GND bypass 1. input 1.03 15 OSC input 1.8 (for upconverter) 16 OSC bypass 1.8 (for ...

Page 5

ABSOLUTE MAXIMUM RATINGS Supply Voltage V CC Power Dissipation package allowance Operating Temperature T opt Storage Temperature T stg RECOMMENDED OPERATING CONDITIONS PARAMETERS SYMBOL Supply Voltage V CC Operating Temperature T opt ELECTRICAL CHARACTERISTICS (T PARAMETERS 1 ...

Page 6

STANDARD CHARACTERISTIC FOR REFERENCE (T PARAMETERS UPCONVERTER BLOCK 3rd order intermodulation distortion DOWNCONVERTER BLOCK IF output 1 dB compression Local leakage at IF out Pin RF leakage at IF out Pin 2 ...

Page 7

TEST CIRCUIT (IF) Spectrum Analyzer 50 51 120 pF 1 500 120 pF 120 Signal Generator 50 Signal Generator (LO) 1 ...

Page 8

TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD OSC IN NEC PC8100 OUT OSC OUT 8 IC MOUNTED SIDE 120 pF Trimer condenser 4.7 nH 120 COMPONENT ...

Page 9

TYPICAL PERFORMANCE (Unless otherwise specified V – Downconverter block – RF input frequency vs. Noise figure 15.0 Vcc = 2 sweep (–9 dBm +25 ˚ +80 ˚ –30 ˚C A ...

Page 10

Downconverter block – RF input level vs. IF output level and –10 –20 –30 Vcc = 4.5 V – 866 866 – 1016 MH –60 –70 ...

Page 11

Upconverter block – F input level vs. RF outpint level and –10 –20 –30 Vcc = 2.7 V – 150 150.8 MH – 1016 MH –60 T ...

Page 12

Downconverter block – P/S control voltage vs. Circuit Current 50 Vcc = 2 input signal 1.0 2.0 3.0 Power-save-control voltage V Supply voltage vs. Circuit Current 50 Vcc = V P/S ...

Page 13

TYPICAL APPLICATION CT2 BLOCK DIAGRAM RX SW PG131GR TX The application circuits and their parameters are for references only and are not intended for use in actual design-in's. PLL 0° F/F 90° PC8100GR PC8101GR Data Sheet P10817EJ3V0DS00 PC8100GR I DEMO ...

Page 14

PACKAGE DIMENSIONS 20 PIN PLASTIC SSOP (225 mil) (UNIT: mm 6.7 0.3 1.8 MAX. 1.5 0.1 0.65 +0.10 0.10 0.22 –0.05 0.1 0.1 NOTE Each lead centerline is located within 0. its true position (T.P.) at ...

Page 15

NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins ...

Page 16

NESAT (NEC Silicon Advanced Technology trademark of NEC Corporation. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. No part of this document may ...

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