74LVC2G66DC PHILIPS [NXP Semiconductors], 74LVC2G66DC Datasheet - Page 19
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74LVC2G66DC
Manufacturer Part Number
74LVC2G66DC
Description
Bilateral switch
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
1.74LVC2G66DC.pdf
(22 pages)
Philips Semiconductors
Fig 24. Package outline VSSOP8.
9397 750 13259
Product data sheet
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT765-1
max.
A
1
0.15
0.00
A 1
8
1
Z
0.85
0.60
A 2
y
IEC
e
0.12
A 3
pin 1 index
D
0
0.27
0.17
b p
b p
MO-187
0.23
0.08
5
JEDEC
4
c
w
REFERENCES
D
2.1
1.9
M
(1)
Rev. 01 — 29 June 2004
E
2.4
2.2
(2)
c
JEITA
scale
2.5
0.5
e
A
H E
3.2
3.0
A 2
detail X
A 1
0.4
L
H E
E
0.40
0.15
L p
0.21
0.19
Q
5 mm
L
L p
PROJECTION
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
EUROPEAN
Q
0.2
v
A
(A 3 )
0.13
74LVC2G66
w
X
v
M
0.1
y
A
Bilateral switch
ISSUE DATE
02-06-07
Z
0.4
0.1
(1)
SOT765-1
8
0
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