MAX5195EGM MAXIM [Maxim Integrated Products], MAX5195EGM Datasheet - Page 15

• Manufacturer Part Number: MAX5195EGM
• Description: 14-Bit, 260Msps High-Dynamic Performance DAC
• Manufacturer: MAXIM [Maxim Integrated Products]

The power-supply voltages should also be decoupled
at the point where they enter the PC board with tanta-
lum or electrolytic capacitors. Ferrite beads with addi-
tional decoupling capacitors forming a π network can
also improve performance.
The analog and digital power-supply inputs AV
DV
voltage range.
The MAX5195 is packaged in a thermally enhanced 48-
pin QFN-EP package, providing greater design flexibili-
ty, increased thermal efficiency, and a low thermal
junction-case (θjc) resistance of ≈2°C/W. In this pack-
age, the data converter die is attached to an EP lead
frame. The back of the lead frame is exposed at the
package bottom surface (the PC board side of the
package, Figure 9. This allows the package to be
attached to the PC board with standard infrared (IR)
flow soldering techniques. A specially created land pat-
tern on the PC board, matching the size of the EP
(5.5mm
chip, and can also be used for heat-sinking purposes.
Designing thermal vias* into the land area and imple-
menting large ground planes in the PC board design
further enhance the thermal conductivity between
board and package. To remove heat from a 48-pin
QFN-EP package effectively, an array of 3
*Connect the land pattern to internal or external copper
planes.
Figure 9. MAX5195 Exposed Paddle/PC Board Cross Section
CC
TOP LAYER
GROUND PLANE
AGND, DGND
POWER PLANE
GROUND PLANE (AGND)
Enhanced Thermal Dissipation QFN-EP Package
of the MAX5195 allow a 4.75V to 5.25V supply
✕
5.5mm), guarantees proper attachment of the
______________________________________________________________________________________
3 x 3 ARRAY OF THERMAL VIAS
COPPER TRACE, 1oz
COPPER PLANE, 1oz
DIE
14-Bit, 260Msps High-Dynamic
THERMAL LAND
CC
✕
3 (or
and
greater) vias (≤0.3mm diameter per via hole and 1.2mm
pitch between via holes) is recommended. A smaller via
array can be used as well, but results in an increased θja.
Note that efficient thermal management for the MAX5195
is strongly dependent on PC board and circuit design,
component placement, and installation; therefore, exact
performance figures cannot be provided. For more infor-
mation on proper design techniques and recommenda-
tions to enhance the thermal performance of parts such
as the MAX5195, refer to Amkor Technology’s website at
www.amkor.com.
Integral nonlinearity is the deviation of the values on an
actual transfer function from either a best-straight-line
fit (closest approximation to the actual transfer curve)
or a line drawn between the endpoints of the transfer
function, once offset and gain errors have been nulli-
fied. For a DAC, the deviations are measured every
individual step.
Differential nonlinearity is the difference between an
actual step height and the ideal value of 1LSB. A DNL
error specification of less than 1LSB guarantees no
missing codes and a monotonic transfer function.
Static Performance Parameter Definitions
Performance DAC
48-LEAD QFN PACKAGE
WITH EXPOSED PAD
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
MAX5195
COPPER
TRACE, 1oz
BONDING WIRE
EPOXY
EXPOSED PAD
PC BOARD
15