HI5714/6CB INTERSIL [Intersil Corporation], HI5714/6CB Datasheet - Page 12

• Manufacturer Part Number: HI5714/6CB
• Description: 8-Bit, 40/60/75/80 MSPS A/D Converter
• Manufacturer: INTERSIL [Intersil Corporation]

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
SUBSTRATE POTENTIAL (Powered Up):
PASSIVATION:
Metallization Mask Layout
134 mils x 134 mils x 19 mils 1 mil
Type: AlSiCu
Thickness: M1 - 8k
GND (0.0V)
Type: Sandwich Passivation*
Thickness: USG - 8k
Total 12.2k
Undoped Silicon Glass (USG) + Nitride
Å
AGND
V
+ 2k
V
CCA
V
V
RB
RT
IN
Å
Å
, M2 - 17k
Å
, Nitride - 4.2k
O/UF
DO
Å
Å
D7
D1
D6
HI5714
D2
HI5714
12
WORST CASE CURRENT DENSITY:
TRANSISTOR COUNT:
DIE ATTACH:
1.6 x 10
3714
Silver Filled Epoxy
D5
D3
4
A/cm
D4
2
OE
V
OGND
V
V
DGND
CLK
CC02
CC01
CCD