X9251-2.7 INTERSIL [Intersil Corporation], X9251-2.7 Datasheet - Page 2
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X9251-2.7
Manufacturer Part Number
X9251-2.7
Description
Single Supply/Low Power/256-Tap/SPI Bus
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.X9251-2.7.pdf
(22 pages)
Ordering Information
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9251UP24I
X9251US24*
X9251US24Z* (Note)
X9251US24I*
X9251US24IZ* (Note)
X9251UV24
X9251UV24Z (Note)
X9251UV24I
X9251UV24IZ (Note)
X9251TP24I
X9251TS24*
X9251TS24Z* (Note)
X9251TS24I*
X9251TS24IZ* (Note)
X9251TV24
X9251TV24Z (Note)
X9251TV24I
X9251TV24IZ (Note)
X9251US24-2.7*
X9251US24Z-2.7* (Note)
X9251US24I-2.7*
X9251US24IZ-2.7* (Note)
X9251UV24-2.7
X9251UV24Z-2.7 (Note)
X9251UV24I-2.7
X9251UV24IZ-2.7 (Note)
X9251TS24-2.7*
X9251TS24Z-2.7* (Note)
X9251TS24I-2.7*
X9251TS24IZ-2.7* (Note)
X9251TV24-2.7
X9251TV24Z-2.7 (Note)
X9251TV24I-2.7
X9251TV24IZ-2.7 (Note)
PART NUMBER
X9251UP I
X9251US
X9251US Z
X9251US I
X9251US Z I
X9251UV
X9251UV Z
X9251UV I
X9251UV Z I
X9251TS
X9251TS Z
X9251TS I
X9251TS Z I
X9251TV
X9251TV Z
X9251TV I
X9251TV Z I
X9251US F
X9251US Z F
X9251US G
X9251US Z G
X9251UV F
X9251UV Z F
X9251UV G
X9251UV Z G
X9251TS F
X9251TS Z F
X9251TS G
X9251TS Z G
X9251TV F
X9251TV Z F
X9251TV G
X9251TV Z G
PART MARKING
2
V
CC
2.7 to 5.5
5 ±10%
LIMITS (V)
X9251
ORGANIZATION (kΩ)
POTENTIOMENTER
100
100
50
50
TEMP RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
(°C)
24 Ld PDIP
24 Ld SOIC (300MIL)
24 Ld SOIC (300MIL) (Pb-Free)
24 Ld SOIC (300MIL)
24 Ld SOIC (300MIL) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld PDIP
24 Ld SOIC (300MIL)
24 Ld SOIC (300MIL) (Pb-Free)
24 Ld SOIC (300MIL)
24 Ld SOIC (300MIL) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld SOIC (300MIL)
24 Ld SOIC (300MIL) (Pb-Free)
24 Ld SOIC (300MIL)
24 Ld SOIC (300MIL) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld SOIC (300MIL)
24 Ld SOIC (300MIL) (Pb-Free)
24 Ld SOIC (300MIL)
24 Ld SOIC (300MIL) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
PACKAGE
September 14, 2005
FN8166.2