MPC870 FREESCALE [Freescale Semiconductor, Inc], MPC870 Datasheet - Page 15
![no-image](/images/no-image-200.jpg)
MPC870
Manufacturer Part Number
MPC870
Description
Hardware Specifications
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
1.MPC870.pdf
(84 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC870CVR133
Manufacturer:
Freescale
Quantity:
560
Company:
Part Number:
MPC870CVR133
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC870CVR66
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC870CZT133
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC870CZT133
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MPC870CZT66
Manufacturer:
MOT
Quantity:
12 388
Company:
Part Number:
MPC870CZT66
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC870VR133
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC870VR133
Manufacturer:
FREE
Quantity:
20 000
Company:
Part Number:
MPC870VR66
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MPC870VR80
Manufacturer:
Freescale
Quantity:
679
Layout Practices
10 Layout Practices
Each V
pin should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct groups
of logic on chip. The V
located as close as possible to the four sides of the package. Each board designed should be characterized and
additional appropriate decoupling capacitors should be used if required. The capacitor leads and associated printed
circuit traces connecting to chip V
minimum, a four-layer board employing two inner layers as V
All output pins on the MPC875/870 have fast rise and fall times. Printed circuit (PC) trace interconnection length
should be minimized in order to minimize undershoot and reflections caused by these fast output switching times.
This recommendation particularly applies to the address and data buses. Maximum PC trace lengths of six inches
are recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to
the PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher
capacitive loads because these loads create higher transient currents in the V
inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the
PLL supply pins. For more information, please refer to Section 14.4.3, “Clock Synthesizer Power (V
V
11 Bus Signal Timing
The maximum bus speed supported by the MPC875/870 is 80 MHz. Higher-speed parts must be operated in
half-speed bus mode (for example, an MPC875/870 used at 133 MHz must be configured for a 66 MHz bus).
shows the frequency ranges for standard part frequencies in 1:1 bus mode, and Table 9 shows the frequency ranges
for standard part frequencies in 2:1 bus mode.
15
SSSYN
PCDIR
(Port C data direction register)
PDPAR
(Port D pin assignment register)
PDDIR
(Port D data direction register)
Core frequency
Bus frequency
DD
, V
pin on the MPC875/870 should be provided with a low-impedance path to the board’s supply. Each GND
SSSYN1
Table 8. Frequency Ranges for Standard Part Frequencies (1:1 Bus Mode)
),” of the MPC885 PowerQUICC Family User’s Manual.
Table 7. Mandatory Reset Configuration of MPC875/870 (continued)
DD
power supply should be bypassed to ground using at least four 0.1-µF bypass capacitors
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Register/Configuration
Part Frequency
MPC875/MPC870 Hardware Specifications, Rev. 3.0
DD
and GND should be kept to less than half an inch per capacitor lead. At a
DD
and GND planes should be used.
Min
DD
40
40
PCDIR[4:5]
PCDIR[8:9]
PCDIR[14]
PDPAR[3:7]
PDPAR[9:5]
PDDIR[3:7]
PDDIR[9:15]
66 MHz
and GND circuits. Pull up all unused
66.67
66.67
Max
Field
Freescale Semiconductor
Min
40
40
80 MHz
DDSYN
(binary)
Value
Max
80
80
0
0
0
Table 8
,