CY8C54 CYPRESS [Cypress Semiconductor], CY8C54 Datasheet - Page 91

• Manufacturer Part Number: CY8C54
• Description: Programmable System-on-Chip (PSoC)
• Manufacturer: CYPRESS [Cypress Semiconductor]

Document Number: 001-55036 Rev. *A
0.08
LASER MARK
SEATING PLANE
PIN 1 DOT
0.20 MAX.
1.60 MAX.
25
1.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.17g
4. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1
7
1
1
HATCH AREA IS SOLDERABLE EXPOSED METAL.
1
8
Figure 13-2. 68-Pin QFN 8x8 with 0.4 mm Pitch Package Outline (Sawn Version)
6
8
100
26
8.000±0.100
TOP VIEW
Figure 13-3. 100-Pin TQFP (14 x 14 x 1.4 mm) Package Outline
16.00±0.25 SQ
14.00±0.05 SQ
PRELIMINARY
5
2
3
4
5
1
3
5
SEE DETAIL
76
50
12°±1°
0.900±0.100
(8X)
75
51
1.40±0.05
A
NOTE:
1. JEDEC STD REF MS-026
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH
3. DIMENSIONS IN MILLIMETERS
0.50
TYP.
SIDE VIEW
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE
BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH
STAND-OFF
PSoC
0.15 MAX.
0.05 MIN.
0.200 REF
0.05 MAX
DETAIL
TOP LEFT CORNER CHAMFER
®
5: CY8C54 Family Data Sheet
5.7±0.10
0.400±0.100
A
0.20±0.05
R 0.08 MIN.
0.20 MAX.
5
1
3
5
5
2
3
4
0° MIN.
NOTE: PKG. CAN HAVE
SOLDERABLE
EXPOSED
BOTTOM VIEW
6.40 REF
0.400 PITCH
PAD
OR
5.7±0.10
0 0 12.0000
0.60±0.15
0°-7°
4 CORNERS CHAMFER
R 0.08 MIN.
0.20 MAX.
001-09618 *C
0.25
51-85048-*C
6
8
1
8
GAUGE PLANE
Page 91 of 93
1
7
1
PIN1 ID
R 0.20
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