AD8117_07 AD [Analog Devices], AD8117_07 Datasheet - Page 7

• Manufacturer Part Number: AD8117_07
• Manufacturer: AD [Analog Devices]

ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Analog Supply Voltage (V
Digital Supply Voltage (V
Ground Potential Difference
Maximum Potential Difference
Common-Mode Analog Input
Differential Analog Input Voltage
Digital Input Voltage
Output Voltage
Output Short-Circuit Duration
Output Short-Circuit Current
Storage Temperature
Operating Temperature Range
Lead Temperature
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
304-Ball BGA
JA
(V
(V
Voltage
(Disabled Analog Output)
(Soldering 10 sec)
is specified for the worst-case conditions, that is, a device
NEG
DD
– V
– D
NEG
GND
)
)
θ
14
JA
DD
POS
θ
1
– D
– V
JC
GND
NEG
)
)
θ
6.5
JB
Rating
6 V
6 V
+0.5 V to −2.5 V
8 V
V
±2 V
V
(V
Momentary
80 mA
−65°C to +125°C
−40°C to +85°C
300°C
150°C
NEG
DD
POS
ψ
0.6
to V
JT
− 1 V) to (V
POS
ψ
5.7
JB
NEG
+ 1 V)
Unit
°C/W
Rev. A | Page 7 of 36
POWER DISSIPATION
The AD8117/AD8118 are operated with ±2.5 V or +5 V
supplies and can drive loads down to 100 Ω, resulting in a large
range of possible power dissipations. For this reason, extra care
must be taken derating the operating conditions based on
ambient temperature.
Packaged in a 304-ball BGA, the AD8117/AD8118 junction-to-
ambient thermal impedance (θ
reliability, the maximum allowed junction temperature of the
die should not exceed 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
stresses exerted on the die by the package. Exceeding a junction
temperature of 175°C for an extended period can result in
device failure. The following curve shows the range of allowed
internal die power dissipations that meet these conditions over
the −40°C to +85°C ambient temperature range. When using
the table, do not include external load power in the maximum
power calculation, but do include load current dropped on the
die output transistors.
ESD CAUTION
Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature
8
7
6
5
4
15
25
AMBIENT TEMPERATURE (°C)
35
45
JA
) is 14°C/W. For long-term
55
AD8117/AD8118
65
T
J
= 150°C
75
85