AD8139 AD [Analog Devices], AD8139 Datasheet - Page 7

• Manufacturer Part Number: AD8139
• Description: Low Noise Rail-to-Rail Differential ADC Driver
• Manufacturer: AD [Analog Devices]

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
V
Power Dissipation
Input Common-Mode Voltage
Storage Temperature
Operating Temperature Range
Lead Temperature Range
(Soldering 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rat-
ing only; functional operation of the device at these or any
other conditions above those indicated in the operational sec-
tion of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
for device soldered in circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
SOIC-8 with EP/4-Layer
LFCSP/4-Layer
Maximum Power Dissipation
The maximum safe power dissipation in the AD8139 package is
limited by the associated rise in junction temperature (T
die. At approximately 150°C, which is the glass transition tem-
perature, the plastic will change its properties. Even temporarily
exceeding this temperature limit may change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the AD8139. Exceeding a junction temperature of
175°C for an extended period of time can result in changes in the
silicon devices potentially causing failure.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features proprie-
tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic
discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
JA
OCM
is specified for the worst-case conditions, i.e., θ
Rating
12 V
±V
See Figure 3
±V
–65°C to +125°C
–40°C to +125°C
300°C
150°C
S
S
θ
70
70
JA
JA
is specified
Unit
°C/W
°C/W
J
) on the
Rev. A | Page 7 of 24
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
and common-mode currents flowing to the load, as well as
currents flowing through the external feedback networks and
the internal common-mode feedback loop. The internal resistor
tap used in the common-mode feedback loop places a 1 kΩ
differential load on the output. RMS output voltages should be
considered when dealing with ac signals.
Airflow reduces θ
the package leads from metal traces, through holes, ground, and
power planes will reduce the θ
Figure 3 shows the maximum safe power dissipation in the
package versus the ambient temperature for the exposed paddle
(EP) SOIC-8 (θ
70°C/W) on a JEDEC standard 4-layer board. θ
approximations.
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–40
–20
JA
= 70°C/W) package and LFCSP (θ
JA
. Also, more metal directly in contact with
S
). The load current consists of differential
0
AMBIENT TEMPERATURE (°C)
20
AND LFCSP
JA
SOIC
.
40
60
D
) is the sum of the
80
JA
S
) times the
values are
100
JA
AD8139
=
120