MLX90255KUC-BCV MELEXIS [Melexis Microelectronic Systems], MLX90255KUC-BCV Datasheet

MLX90255KUC-BCV

Manufacturer Part Number

MLX90255KUC-BCV

Description

Linear Optical Array

Manufacturer

MELEXIS [Melexis Microelectronic Systems]

Datasheet

1.MLX90255KUC-BCV.pdf (12 pages)

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Features and Benefits

Applications

Ordering Information

Part No.

MLX90255

1. Functional Diagram

390109025503

Rev. 001

Hold

Integrator Reset

Pixel 1

132-Bit Shift Register

128 x 1 Sensor-Element Organization (1 Not Connected, 1 dummy, 128 real, 1 dummy

and 1 Dark Pixel)

385 Dots-Per-Inch (DPI) Sensor Pitch

High Linearity and Uniformity for 256 Gray-Scale (8-Bit) Applications

High Sensitivity: 2.0V @ 10µW/cm² @ 0.7ms integration time for open cavity devices

Special Gain Compensation for use with single LED light source

Output Referenced to Ground

Low Image Lag

Single 5V Supply

Replacement for TAOS, Inc. TSL1301 & TSL1401 and MLX90255BA

Operation to 800kHz

Linear Position Encoder

Rotary Position Encoder

Steering Torque and Angle Sensing (EPAS, ESP)

Spectrometer Applications

Bio-metrical Applications

OCR and Barcode Applications

Sample

Switching Logic

Pixel 2

Temperature Suffix

K (-40°C to 125°C)

1.7V @ 10µW/cm² @ 0.7ms integration time for glass lid devices

Pixel 132

Q132

External

Load

Page 1 of 12

Package Code

XA (SOIC-24 without glass)

UC (Die on wafer (un-sawn))

2. Description

The MLX90255BC linear sensor array consists

of a 128 x 1 array of photodiodes, associated

charge amplifier circuitry and a pixel data-hold

function that provides simultaneous-integration

start and stop times for all pixels. The pixels

measure 200µm (H) by 66 µm (W). Operation is

simplified by internal control logic that requires

only a serial-input (SI) signal and a clock.

The

arranged in a linear array. Light energy falling on

a photodiode generates photocurrent, which is

integrated by the active integration circuitry

associated with that pixel. During the integration

period, a sampling capacitor connects to the

output of the integrator through an analog

switch. The amount of charge accumulated at

each pixel is directly proportional to the light

intensity and the integration time. The output

and reset of the integrators is controlled by a

132-bit shift register and reset logic. An output

cycle is initiated by clocking in a logic 1 on SI.

(continued on page 5)

sensor

MLX90255-BC

consists

Linear Optical Array

128

Option code

-BCR

-BCV

photodiodes

Nov/05

Related parts for MLX90255KUC-BCV

MLX90255KUC-BCV Summary of contents

Page 1

Features and Benefits 128 x 1 Sensor-Element Organization (1 Not Connected, 1 dummy, 128 real, 1 dummy and 1 Dark Pixel) 385 Dots-Per-Inch (DPI) Sensor Pitch High Linearity and Uniformity for 256 Gray-Scale (8-Bit) Applications High Sensitivity: 2.0V @ 10µW/cm² ...

Page 2

... COSINE CORRECTION ........................................................................................................................ 6 7. PERFORMANCE GRAPHS................................................................................................................... 7 8. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS WITH DIFFERENT SOLDERING PROCESSES .......................................................................................... 8 9. ESD PRECAUTIONS............................................................................................................................. 8 10. PACKAGE INFORMATION................................................................................................................... 9 10.1. MLX90255KXA-BCR (SOIC-24 10.2. XA (SOIC-24 WITHOUT GLASS 10.3. MLX90255KUC-BCV (W 11. DISCLAIMER ....................................................................................................................................... 12 390109025503 Rev. 001 MLX90255-BC TABLE OF CONTENTS ) WITHOUT GLASS PACKAGE DIMENSIONS ) P D ...................................................................................10 IN ESCRIPTION P ) ...

Page 3

MLX90255BC Electrical Specifications DC Operating Parameters T = -40 A Parameter Symbol Notes: (1) Reset until clock pulse 18 (on declining flank). Minimum integration time = (133-18) * CLK period + 10µs (this is the time the S&H cap ...

Page 4

MLX90255BC Electrical specifications All tests are made with 0.7ms integration time at 25°C at 880nm and with a clock speed of 500kHz in, 250kHz out, and 500kHz, unless otherwise specified in the Test Conditions. 100% light under Test Conditions means ...

Page 5

General Description (continued from page 1) This causes all 132 sampling capacitors to be disconnected from their respective integrators and starts an integrator reset period. As the SI pulse is clocked through the shift register, the charge stored on ...

Page 6

Cosine Correction When using a single LED light source, which is placed above the middle of the die, the light intensity that falls onto the outer pixels is lower than the light intensity that falls onto the middle pixels ...

Page 7

Performance Graphs Typical Photodiode Spectral Response Curve (%), without Anti Reflection Coating* *There is also an option for an Anti Reflection Coating. This will remove the interference ripples in the figure above. With this special Anti Reflection Coating, the ...

Page 8

Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) IPC/JEDEC J-STD-020 • ...

Page 9

Package Information 10.1. MLX90255KXA-BCR (SOIC-24 without glass) package dimensions A = 200um pixel height B = 132 x 66um = 8712um, mid 128 pixels are usefull pixels C = 3.53 +/- 0.13 (tolerance is indicated on the drawing as ...

Page 10

XA (SOIC-24 without glass) Pin Description Pin Sym Description bol 390109025503 Rev. 001 MLX90255-BC Linear Optical Array Page Nov/05 ...

Page 11

... MLX90255KUC-BCV (Wafer Polyimide) Die on wafer (unsawn) with polyimide passivation. Advantages: Extra adhesion by polyimide layer • Disadvantages: The sensitivity of a wafer with polyimide layer is ~20% less than on a normal wafer • without this layer Light Transmission Properties of Polyimide Layer Method of Measurement: Testwafer with AlSiCu + Passivation Layer • ...

Page 12

Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied description regarding the information set forth herein or regarding the ...

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