ADV3201 AD [Analog Devices], ADV3201 Datasheet - Page 7

• Manufacturer Part Number: ADV3201
• Manufacturer: AD [Analog Devices]

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Analog Supply Voltage
Digital Supply Voltage
Ground Potential Difference
Maximum Potential Difference
VREF Input Voltage
Analog Input Voltage
Digital Input Voltage
Output Voltage
Output Short-Circuit Duration
Output Short-Circuit Current
Storage Temperature Range
Operating Temperature Range
Lead Temperature
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
176-Lead LQFP_EP
JA
(VPOS − VNEG)
(DVCC − DGND)
(VNEG − DGND)
DVCC − VNEG
Disabled Outputs
|VCLAMP − V
ADV3200
ADV3201
(Disabled Analog Output)
(Soldering 10 sec)
is specified for the worst-case conditions, that is, a device
ADV3200 (|V
ADV3201
(|V
OSD
− (V
INxx
OSD
OUT
|
− V
+ VREF)/2|)
OUT
|)
Rating
7.5 V
6 V
+0.5 V to −4 V
9.4 V
<3 V
<3 V
6 V
VPOS − 3.5 V to VNEG + 3.5 V
VPOS − 4 V to VNEG + 4 V
VNEG to VPOS
DVCC
(VPOS − 1 V) to (VNEG + 1 V)
Momentary
45 mA
−65°C to +125°C
−40°C to +85°C
300°C
150°C
θ
16
JA
Unit
°C/W
Rev. 0 | Page 7 of 36
POWER DISSIPATION
The ADV3200/ADV3201 are operated with ±2.5 V, 5 V, or
±3.3 V supplies and can drive loads down to 150 Ω, resulting in
a large range of possible power dissipations. For this reason,
extra care must be taken to derate the operating conditions
based on ambient temperature.
The ADV3200/ADV3201 are packaged in a 176-lead exposed
pad LQFP. The junction-to-ambient thermal impedance (θ
the ADV3200/ADV3201 is 16°C/W. For long-term reliability,
the maximum allowed junction temperature of the die should
not exceed 150°C. Temporarily exceeding this limit may cause a
shift in parametric performance due to a change in stresses
exerted on the die by the package. Exceeding a junction
temperature of 175°C for an extended period can result in
device failure. Figure 4 shows the range of allowed internal die
power dissipations that meet these conditions over the −40°C to
+85°C ambient temperature range. When using Figure 4, do not
include external load power in the maximum power calculation,
but do include load current dropped on the die output
transistors.
ESD CAUTION
9
8
7
6
5
4
3
Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature
15
25
AMBIENT TEMPERATURE (°C)
35
45
ADV3200/ADV3201
55
65
T
J
= 150°C
75
JA
) of
85