AT24C256C-W11 ATMEL [ATMEL Corporation], AT24C256C-W11 Datasheet - Page 13

• Manufacturer Part Number: AT24C256C-W11
• Description: Two-wire Serial EEPROM
• Manufacturer: ATMEL [ATMEL Corporation]

7.
7.1.
7.2.
8568A–SEEPR–9/09
Ordering Information
Ordering Code Detail
AT24C256C Ordering Codes
Note:
AT24C256C-SSHL-B
AT24C256C-SSHL-T
AT24C256C-XHL-B
AT24C256C-XHL-T
AT24C256C-MAHL-T
AT24C256C-CUL-T
AT24C256C-W11
8U2-1
8MA2
Atmel Designator
8S1
8A2
Device Revision
Product Family
Device Density
1. “-B” denotes bulk.
2. “-T” denotes tape & reel. SOIC = 4K per reel. TSSOP, VFBGA and UDFN = 5K per reel.
3. Bumped die available upon request. Contact Atmel Marketing.
256 = 256K
8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 4.40mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Dual No Lead Package (UDFN)
8-ball, die Ball Grid Array Package (VFBGA)
Ordering Code
(3)
(2)
(1)
(2)
(2)
(1)
(2)
A T 2 4 C 2 5 6 C - S S H L - B
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
Voltage
Package Type
Package
Die Sale
8U2-1
8MA2
8S1
8S1
8A2
8A2
AT24C256C [Preliminary]
Industrial Temperature (−40°C to 85°C)
Industrial Temperature (−40°C to 85°C)
Shipping Carrier Option
B or blank = Bulk (tubes)
T
Operating Voltage
L
Package Device Grade or
Wafer/Die Thickness
H
U
11 = 11mil wafer thickness
Package Option
SS = JEDEC SOIC
X
MA = UDFN
W = wafer
WT = die in tape and reel
C
= Tape and reel
= 1.7V to 5.5V
= Green, NiPdAu lead finish,
= Green, matte Sn lead finish,
= TSSOP
= UFBGA
Industrial Temperature Range
(-40°C to +85°C)
Industrial Temperature Range
(-40°C to +85°C)
Lead-free/Halogen-free
Operating Range
13