AT24CS01 ATMEL [ATMEL Corporation], AT24CS01 Datasheet - Page 19

• Manufacturer Part Number: AT24CS01
• Description: I2C-Compatible (2-wire) Serial EEPROM
• Manufacturer: ATMEL [ATMEL Corporation]

14.2
8X — 8-lead TSSOP
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Package Drawing Contact:
Notes:
1. This drawing is for general information only. Refer to JEDEC
2. Dimension D does not include mold Flash, protrusions or gate
3. Dimension E1 does not include inter-lead Flash or protrusions.
4. Dimension b does not include Dambar protrusion. Allowable
5. Dimension D and E1 to be determined at Datum Plane H.
Top View
Drawing MO-153, Variation AA, for proper dimensions,
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
Dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
Side View
tolerances, datums, etc.
Pin 1 indicator
this corner
D
b
e
1
N
A2
TITLE
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
E1
A
A1
E
Atmel AT24CS01/02 [PRELIMINARY DATASHEET]
H
End View
SYMBOL
C
A
A1
A2
D
E
E1
b
e
L
L1
C
0.05
0.80
2.90
4.30
0.19
0.45
0.09
COMMON DIMENSIONS
MIN
L
(Unit of Measure = mm)
-
L1
GPC
6.40 BSC
0.65 BSC
1.00 REF
TNR
NOM
1.00
3.00
4.40
0.60
–
-
-
-
DRAWING NO.
8815A–SEEPR–6/12
MAX
1.20
0.15
1.05
3.10
4.50
0.30
0.75
0.20
8X
NOTE
2, 5
3, 5
4
12/8/11
REV.
E
19