IS42S32160B-6BL ISSI [Integrated Silicon Solution, Inc], IS42S32160B-6BL Datasheet

no-image

IS42S32160B-6BL

Manufacturer Part Number
IS42S32160B-6BL
Description
16M x 32 512Mb SYNCHRONOUS DRAM
Manufacturer
ISSI [Integrated Silicon Solution, Inc]
Datasheet
IS42S32160B
IS45S32160B
16M x 32
512Mb SYNCHRONOUS DRAM
FEATURES
• Clock frequency: 166, 143 MHz
• Fully synchronous; all signals referenced to a
• Internal bank for hiding row access/precharge
• Single Power supply: 3.3V + 0.3V
• LVTTL interface
• Programmable burst length
• Programmable burst sequence:
• Auto Refresh (CBR)
• Self Refresh
• 8192 refresh cycles every 16ms (A2 grade) or
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
• Burst termination by burst stop and precharge
OPTIONS
• Package:
• Operating Temperature Range:
• Die Revision: B
Integrated Silicon Solution, Inc. - www.issi.com
Rev. 00B
07/01/09
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
positive clock edge
– (1, 2, 4, 8, full page)
Sequential/Interleave
64 ms (Commercial, Industrial, A1 grade)
operations capability
command
86-pin TSOP-II
90-ball W-BGA
Commercial (0
Industrial (-40
Automotive Grade, A1 (-40
Automotive Grade, A2 (-40
o
C to +85
o
C to +70
o
C)
o
C)
o
o
C to +85
C to +105
o
C)
o
C)
KEY TIMING PARAMETERS
ADDRESS TABLE
OVERVIEW
ISSI
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock input.
The 512Mb SDRAM is organized in 4Meg x 32 bit x 4
Banks.
Parameter
Configuration
Refresh Count
Row Addresses
Column
Addresses
Bank Address
Pins
Autoprecharge
Pins
Parameter
Clk Cycle Time
Clk Frequency
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
's 512Mb Synchronous DRAM achieves high-speed
PRELIMINARY INFORMATION
Com./Ind.
A1
A2
166
100
5.4
6.5
10
-6
6
JULY 2009
16M x 32
4M x 32 x 4 banks
8K / 64ms
8K / 64ms
8K / 16ms
A0 – A12
A0 – A8
BA0, BA1
A10/AP
143
100
5.4
6.5
-7
10
7
-75E Unit
133
7.5
5.5
Mhz
Mhz
ns
ns
ns
ns
1

Related parts for IS42S32160B-6BL

IS42S32160B-6BL Summary of contents

Page 1

... IS42S32160B IS45S32160B 16M x 32 512Mb SYNCHRONOUS DRAM FEATURES • Clock frequency: 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Single Power supply: 3.3V + 0.3V • LVTTL interface • Programmable burst length – ...

Page 2

... IS42S32160B, IS45S32160B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in 3.3V V and 3.3V V memory systems containing 536,870,912 ddq bits. Internally configured as a quad-bank DRAM with a synchronous interface. Each 134,217,728-bit bank is organized as 8,192 rows by 512 columns by 32 bits The 512Mb SDRAM includes an AUTO REFRESH MODE, and a power-saving, power-down mode ...

Page 3

... IS42S32160B, IS45S32160B PIN CONFIGURATIONS 86 pin TSOP - Type II for x32 V DD DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQM0 WE CAS RAS CS A11 BA0 BA1 A10 DQM2 DQ16 DQ17 DQ18 DQ19 DQ20 ...

Page 4

... IS42S32160B, IS45S32160B PIN CONFIGURATION PACKAGE CODE BALL W-BGA (Top View) (11. 13.00 mm Body, 0.8 mm Ball Pitch PIN DESCRIPTIONS A0-A12 Row Address Input A0-A8 Column Address Input BA0, BA1 Bank Select Address DQ0 to DQ31 Data I/O CLK System Clock Input ...

Page 5

... IS42S32160B, IS45S32160B PIN FUNCTIONS Symbol Type A0-A12 Input Pin BA0, BA1 Input Pin CAS Input Pin CKE Input Pin CLK Input Pin CS Input Pin DQM0-DQM3 Input Pin DQ0-DQ31 Input/Output Pin RAS Input Pin WE Input Pin V Power Supply Pin ddq V Power Supply Pin ...

Page 6

... IS42S32160B, IS45S32160B GENERAL DESCRIPTION READ The READ command selects the bank from BA0, BA1 inputs and starts a burst read access to an active row. Inputs A0-A8 provides the starting column location. When A10 is HIGH, this command functions as an AUTO PRECHARGE command. When the auto precharge is selected, the row being accessed will be precharged at the end of the READ burst ...

Page 7

... IS42S32160B, IS45S32160B COMMAND TRUTH TABLE CKE Function n – 1 Device deselect (DESL operation (NOP) H Burst stop (BST) H Read H Read with auto precharge H Write H Write with auto precharge H Bank activate (ACT) H Precharge select bank (PRE) H Precharge all banks (PALL) H CBR Auto-Refresh (REF) ...

Page 8

... IS42S32160B, IS45S32160B CKE TRUTH TABLE Current State /Function Activating Clock suspend mode entry Any Clock suspend mode Clock suspend mode exit Auto refresh command Idle (REF) Self refresh entry Idle (SELF) Power down entry Idle Self refresh exit Power down exit ...

Page 9

... IS42S32160B, IS45S32160B FUNCTIONAL TRUTH TABLE Current State CS RAS CAS Idle Row Active Read ...

Page 10

... IS42S32160B, IS45S32160B FUNCTIONAL TRUTH TABLE Continued: Current State CS RAS CAS Read with auto H × × Precharging Write with Auto H × × Precharge ...

Page 11

... IS42S32160B, IS45S32160B FUNCTIONAL TRUTH TABLE Continued: Current State CS RAS CAS Write Recovering H × × Write Recovering H × × with Auto Precharge ...

Page 12

... IS42S32160B, IS45S32160B CKE RELATED COMMAND TRUTH TABLE Current State Operation Self-Refresh (S.R.) INVALID, CLK ( would exit S.R. Self-Refresh Recovery Self-Refresh Recovery Illegal Illegal Maintain S.R. Self-Refresh Recovery Idle After t rc Idle After t rc Illegal Illegal Begin clock suspend next cycle Begin clock suspend next cycle ...

Page 13

... IS42S32160B, IS45S32160B STATE DIAGRAM Mode Register Set BST Write CKE WRITE WRITE SUSPEND CKE CKE WRITEA WRITEA SUSPEND CKE Precharge POWER ON Integrated Silicon Solution, Inc. - www.issi.com Rev. 00B 07/01/09 SELF SELF exit MRS REF IDLE CKE CKE ACT CKE Row Active CKE ...

Page 14

... IS42S32160B, IS45S32160B ABSOLUTE MAXIMUM RATINGS Symbol Parameters V Maximum Supply Voltage dd max V Maximum Supply Voltage for Output Buffer ddq max V Input Voltage in V Output Voltage out P Allowable Power Dissipation d max I output Shorted Current cs T operating Temperature opr T Storage Temperature stg Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device ...

Page 15

... IS42S32160B, IS45S32160B DC ELECTRICAL CHARACTERISTICS 1 Symbol Parameter i Operating Current (1) dd1 i Precharge Standby Current dd2p (In Power-Down Mode) i Precharge Standby Current dd2ps (In Power-Down Mode) i Precharge Standby Current dd2n (2) (In Non Power-Down Mode) I Precharge Standby Current dd2ns (In Non Power-Down Mode) I Active Standby Current dd3p (Power-Down Mode) ...

Page 16

... IS42S32160B, IS45S32160B AC ELECTRICAL CHARACTERISTICS Symbol Parameter t Clock Cycle Time ck3 t ck2 t Access Time From CLK ac3 t ac2 t CLK HIGH Level Width chi t CLK LOW Level Width cl t Output Data Hold Time oh3 t oh2 t Output LOW Impedance Time lz t Output HIGH Impedance Time ...

Page 17

... IS42S32160B, IS45S32160B OPERATING FREQUENCY / LATENCY RELATIONSHIPS SYMBOL PARAMETER — Clock Cycle Time — Operating Frequency t CAS Latency cac t Active Command To Read/Write Command Delay Time rcd t RAS Latency ( rac rcd cac t Command Period (REF to REF / ACT to ACT Command Period (ACT to PRE) ...

Page 18

... IS42S32160B, IS45S32160B AC TEST CONDITIONS Input Load t CHI 3.0V 1.4V CLK 3.0V INPUT 1. OUTPUT 1.4V AC TEST CONDITIONS Parameter AC Input Levels Input Rise and Fall Times Input Timing Reference Level Output Timing Measurement Reference Level 18 Output Load Output t AC 1.4V 1.4V 50Ω 50Ω ...

Page 19

... IS42S32160B, IS45S32160B FUNCTIONAL DESCRIPTION Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an AC- TIVE command which is then followed by a READ orWRITE command ...

Page 20

... IS42S32160B, IS45S32160B INITIALIzE AND LOAD MODE REGISTER CLK CKS CKH CKE CMH CMS CMH CMS COMMAND NOP PRECHARGE DQM0-DQM3 A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK BA0, BA1 ALL BANKS Power-up: V Precharge CC and CLK stable all banks T = 100µ ...

Page 21

... IS42S32160B, IS45S32160B AUTO-REFRESH CYCLE T0 t CLK CKS CKH CKE t t CMS CMH COMMAND PRECHARGE DQM0 - DQM3 A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK ( High-Z Notes: 1. CAS latency = 2, 3 Integrated Silicon Solution, Inc. - www.issi.com Rev. 00B ...

Page 22

... IS42S32160B, IS45S32160B SELF-REFRESH CYCLE T0 t CLK CKS CKH CKE t t CMS CMH COMMAND PRECHARGE DQM0 - DQM3 A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK High-Z DQ Precharge all active banks CKS ≥ t RAS ...

Page 23

... IS42S32160B, IS45S32160B REGISTER DEFINITION Mode Register The mode register is used to define the specific mode of operation of the SDRAM. This definition includes the selection of a burst length, a burst type, a CAS latency, an operating mode and a write burst mode, as shown in MODE REGISTER DEFINITION. The mode register is programmed via the LOAD MODE REGISTER command and will retain the stored information until it is programmed again or the device loses power ...

Page 24

... IS42S32160B, IS45S32160B BURST LENGTH Read and write accesses to the SDRAM are burst oriented, with the burst length being programmable, as shown in MODE REGISTER DEFINITION. The burst length deter- mines the maximum number of column locations that can be accessed for a given READ or WRITE command. Burst ...

Page 25

... IS42S32160B, IS45S32160B CAS Latency The CAS latency is the delay, in clock cycles, between the registration of a READ command and the availability of the first piece of output data. The latency can be set to two or three clocks READ command is registered at clock edge n, and the latency is m clocks, the data will be available by clock edge ...

Page 26

... IS42S32160B, IS45S32160B CHIP OPERATION BANK/ROW ACTIVATION Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE command, which selects both the bank and the row to be activated (see Activating Specific Row Within Specific Bank). ...

Page 27

... IS42S32160B, IS45S32160B READS READ bursts are initiated with a READ command, as shown in the READ COMMAND diagram. The starting column and bank addresses are provided with the READ command, and auto precharge is either enabled or disabled for that burst access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst ...

Page 28

... IS42S32160B, IS45S32160B diagram for each possible CAS latency; data element either the last of a burst of four or the last desired of a longer burst. Following the PRECHARGE command, a subsequent command to the same bank cannot be issued until t is met. Note that part of the row precharge time is rp hidden during the access of the last data element(s) ...

Page 29

... IS42S32160B, IS45S32160B RW1 - READ to WRITE T0 CLK DQM COMMAND READ BANK, ADDRESS COL n DQ CAS Latency - 2 RW2 - READ to WRITE T0 CLK DQM COMMAND READ BANK, ADDRESS COL n DQ Integrated Silicon Solution, Inc. - www.issi.com Rev. 00B 07/01/ NOP NOP NOP NOP ...

Page 30

... IS42S32160B, IS45S32160B CONSECUTIVE READ BURSTS T0 CLK COMMAND READ BANK, ADDRESS COL n DQ CAS Latency - CLK COMMAND READ NOP BANK, ADDRESS COL n DQ CAS Latency - NOP NOP NOP READ BANK, COL n+1 D OUT OUT NOP NOP ...

Page 31

... IS42S32160B, IS45S32160B RANDOM READ ACCESSES T0 CLK COMMAND READ BANK, ADDRESS COL CLK COMMAND READ BANK, ADDRESS COL n DQ CAS Latency - 3 Integrated Silicon Solution, Inc. - www.issi.com Rev. 00B 07/01/ READ READ READ BANK, BANK, BANK, COL b COL m COL OUT ...

Page 32

... IS42S32160B, IS45S32160B READ BURST TERMINATION T0 CLK COMMAND READ BANK a, ADDRESS COL n DQ CAS Latency - CLK COMMAND READ NOP BANK, ADDRESS COL n DQ CAS Latency - BURST NOP NOP NOP TERMINATE n+1 D OUT OUT BURST NOP NOP ...

Page 33

... IS42S32160B, IS45S32160B ALTERNATING BANK READ ACCESSES CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW BA0, BA1 BANK BANK 0 RCD t RRD ...

Page 34

... IS42S32160B, IS45S32160B READ - FULL-PAGE BURST CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP t CMS DQM0 - DQM3 A0-A9, A11, A12 ROW COLUMN A10 ROW BA0, BA1 BANK DQ t RCD Notes: 1) CAS latency = 2, Burst Length = Full Page 2) x32: A9, A11, A12 = " ...

Page 35

... IS42S32160B, IS45S32160B READ - DQM OPERATION CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW t t DISABLE AUTO PRECHARGE AS AH BA0, BA1 BANK DQ t RCD ...

Page 36

... IS42S32160B, IS45S32160B READ to PRECHARGE T0 T1 CLK COMMAND READ NOP BANK a, ADDRESS COL n DQ CAS Latency - CLK COMMAND READ NOP BANK, ADDRESS COL n DQ CAS Latency - NOP NOP NOP PRECHARGE BANK (a or all n+1 D n+2 D OUT OUT OUT ...

Page 37

... IS42S32160B, IS45S32160B WRITES WRITE bursts are initiated with a WRITE command, as shown in WRITE Command diagram. WRITE COMMAND CLK HIGH CKE CS RAS CAS WE A0-A8 COLUMN ADDRESS A9, A11, A12 AUTO PRECHARGE A10 NO PRECHARGE BA0, BA1 BANK ADDRESS The starting column and bank addresses are provided with the WRITE command, and auto precharge is either enabled or disabled for that access ...

Page 38

... IS42S32160B, IS45S32160B WRITE BURST COMMAND ADDRESS WRITE TO WRITE RANDOM WRITE CYCLES COMMAND ADDRESS CLK WRITE NOP NOP BANK, COL n CLK COMMAND WRITE NOP BANK, ADDRESS COL n DON'T CARE CLK WRITE WRITE ...

Page 39

... IS42S32160B, IS45S32160B WRITE to READ T0 CLK COMMAND WRITE BANK, ADDRESS COL WP1 - WRITE to PRECHARGE T0 CLK DQM COMMAND WRITE BANK a, ADDRESS COL Integrated Silicon Solution, Inc. - www.issi.com Rev. 00B 07/01/ NOP READ NOP BANK, COL b D n+1 IN CAS Latency - 2 ...

Page 40

... IS42S32160B, IS45S32160B WP2 - WRITE to PRECHARGE T0 CLK DQM COMMAND WRITE BANK a, ADDRESS COL WRITE Burst Termination COMMAND ADDRESS NOP NOP NOP PRECHARGE BANK (a or all) t DPL D n CLK BURST WRITE TERMINATE COMMAND BANK, (ADDRESS) COL (DATA) ...

Page 41

... IS42S32160B, IS45S32160B WRITE - FULL PAGE BURST CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW A10 ROW BA0, BA1 BANK DQ t RCD Notes: 1) Burst Length = Full Page 2) x32: A9, A11, A12 = " ...

Page 42

... IS42S32160B, IS45S32160B WRITE - DQM OPERATION CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW A10 ROW BA0, BA1 BANK DQ t RCD Notes: 1) Burst Length = 4 2) x32: A9, A11, A12 = "Don't Care" ...

Page 43

... IS42S32160B, IS45S32160B ALTERNATING BANK WRITE ACCESSES CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP t CMS DQM0 - DQM3 A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW BA0, BA1 BANK ...

Page 44

... IS42S32160B, IS45S32160B CLOCK SUSPEND Clock suspend mode occurs when a column access/burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deactivated, “freezing” the synchronous logic. For each positive clock edge on which CKE is sampled LOW, the next internal positive clock edge is suspended. ...

Page 45

... IS42S32160B, IS45S32160B CLOCK SUSPEND MODE CLK CKS CKH CKE t t CMS CMH COMMAND READ NOP t t CMS CMH DQM0 - DQM3 (2) A0-A9, A11, A12 COLUMN A10 BA0, BA1 BANK DQ Notes: 1) CAS latency = 3, Burst Length = 2, Auto Precharge is disabled. ...

Page 46

... IS42S32160B, IS45S32160B PRECHARGE The PRECHARGE command (see figure) is used to deac- tivate the open row in a particular bank or the open row in all banks.The bank(s) will be available for a subsequent row access some specified time (t ) after the PRECHARGE rp command is issued. Input A10 determines whether one or ...

Page 47

... IS42S32160B, IS45S32160B POWER-DOWN MODE CYCLE T0 CLK t t CKS CKH CKE t t CMS CMH COMMAND PRECHARGE DQM0 - DQM3 A0-A9, A11,A12 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK High-Z DQ Two clock cycles Precharge all All banks idle, enter active banks power-down mode Integrated Silicon Solution, Inc ...

Page 48

... IS42S32160B, IS45S32160B BURST READ/SINGLE WRITE The burst read/single write mode is entered by programming the write burst mode bit (M9) in the mode register to a logic 1. In this mode, all WRITE commands result in the access of a single column location (burst of one), regardless of the programmed burst length. READ commands access ...

Page 49

... IS42S32160B, IS45S32160B WRITE with Auto Precharge 3. Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a WRITE on bank n when registered, with the data-out appearing (CAS latency) later. The PRECHARGE to bank n will begin after t is met, where t begins when the READ to bank m is dpl registered ...

Page 50

... IS42S32160B, IS45S32160B SINGLE READ WITHOUT AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW A10 ROW t t DISABLE AUTO PRECHARGE AS AH BA0, BA1 BANK DQ t RCD t RAS ...

Page 51

... IS42S32160B, IS45S32160B SINGLE READ WITH AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW A10 ROW BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) CAS latency = 2, Burst Length = 1 2) x32: A9, A11, A12 = " ...

Page 52

... IS42S32160B, IS45S32160B READ WITHOUT AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW A10 ROW t t DISABLE AUTO PRECHARGE AS AH BA0, BA1 BANK DQ t RCD t RAS t RC ...

Page 53

... IS42S32160B, IS45S32160B READ WITH AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW BA0, BA1 BANK DQ t RCD t RAS t RC ...

Page 54

... IS42S32160B, IS45S32160B SINGLE WRITE - WITHOUT AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW A10 ROW BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) Burst Length = 1 2) x32: A9, A11, A12 = " ...

Page 55

... IS42S32160B, IS45S32160B SINGLE WRITE WITH AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9, A11, A12 ROW A10 ROW BA0, BA1 BANK DQ t RCD t RAS t RC Notes: 1) Burst Length = 1 2) x32: A9, A11, A12 = " ...

Page 56

... IS42S32160B, IS45S32160B WRITE - WITHOUT AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP DQM0 - DQM3 A0-A9, A11, A12 ROW A10 ROW t t DISABLE AUTO PRECHARGE AS AH BA0, BA1 BANK DQ t RCD t RAS t RC ...

Page 57

... IS42S32160B, IS45S32160B WRITE - WITH AUTO PRECHARGE CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP t CMS DQM0 - DQM3 A0-A9, A11, A12 ROW ENABLE AUTO PRECHARGE A10 ROW BA0, BA1 BANK t DQ ...

Page 58

... IS42S32160B-7BL 90-Ball BGA, Lead-free IS42S32160B-75ETL 86-Pin TSOP-II, Lead-free IS42S32160B-75EBL 90-Ball BGA, Lead-free Order Part No. Package IS42S32160B-6TLI 86-Pin TSOP-II, Lead-free IS42S32160B-6BLI 90-Ball BGA, Lead-free IS42S32160B-7TLI 86-Pin TSOP-II, Lead-free IS42S32160B-7BLI 90-Ball BGA, Lead-free IS42S32160B-75ETLI 86-Pin TSOP-II, Lead-free IS42S32160B-75EBLI 90-Ball BGA, Lead-free Order Part No. ...

Page 59

... IS42S32160B, IS45S32160B Integrated Silicon Solution, Inc. - www.issi.com Rev. 00B 07/01/09 59 ...

Page 60

... IS42S32160B, IS45S32160B 60 e 6.50 5.60±0 Integrated Silicon Solution, Inc. - www.issi.com Rev. 00B 07/01/09 ...

Related keywords