CY62127DV18L-55BVI CYPRESS [Cypress Semiconductor], CY62127DV18L-55BVI Datasheet

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CY62127DV18L-55BVI

Manufacturer Part Number
CY62127DV18L-55BVI
Description
1 Mb (64K x 16) Static RAM
Manufacturer
CYPRESS [Cypress Semiconductor]
Datasheet
Cypress Semiconductor Corporation
Document #: 38-05226 Rev. *A
Features
Functional Description
The CY62127DV18 is a high-performance CMOS static RAM
organized as 64K words by 16 bits. This device features ad-
vanced circuit design to provide ultra-low active current. This
is ideal for providing More Battery Life™ (MoBL
applications such as cellular telephones. The device also has
an automatic power-down feature that significantly reduces
Note:
1.
Logic Block Diagram
• Very high speed: 55 ns
• Voltage range: 1.65V to 2.2V
• Ultra-low active power
• Ultra-low standby power
• Easy memory expansion with CE</> and OE</> fea-
• Automatic power-down when deselected
• Packages offered in a 48-ball FBGA and a 44-lead TSOP
tures
Type II
— Typical active current: 0.5 mA @ f = 1 MHz
— Typical active current: 3.75 mA @ f = f
For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
A
A
A
A
A
A
A
A
A
A
A
10
9
0
5
8
7
4
2
1
6
3
[1]
Power - Down
Circuit
COLUMN DECODER
DATA IN DRIVERS
MAX
®
) in portable
3901 North First Street
RAM Array
2048 X 512
PRELIMINARY
64K x 16
power consumption by 99% when addresses are not toggling.
The device can be put into standby mode reducing power con-
sumption by more than 99% when deselected Chip Enable
(CE) HIGH or both BHE and BLE are HIGH. The input/output
pins (I/O
when: deselected Chip Enable (CE) HIGH, outputs are dis-
abled (OE HIGH), both Byte High Enable and Byte Low Enable
are disabled (BHE, BLE HIGH) or during a write operation
(Chip Enable (CE) LOW and Write Enable (WE) LOW).
Writing to the device is accomplished by taking Chip Enable
(CE) LOW and Write Enable (WE) input LOW. If Byte Low
Enable (BLE) is LOW, then data from I/O pins (I/O
I/Os pins (A
then data from I/O pins (I/O
location specified on the ad
Reading from the device is accomplished by taking Chip En-
able (CE) LOW and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then O
memory will appear on I/O
back of this data sheet for a complete description of re
1 Mb (64K x 16) Static RAM
7
CE
. If Byte High Enable (BHE) is LOW, then data from
0
through I/O
0
BHE
BLE
through A
San Jose
15
15
I/O
I/O
) are placed in a high-impedance state
). If Byte High Enable (BHE) is LOW,
,
0
8
8
CA 95134
–I/O
–I/O
8
to I/O
BHE
WE
CE
OE
BLE
through I/O
7
15
15
. See the truth table at the
CY62127DV18
Revised May 5, 2005
15
) is written into the
MoBL2
408-943-2600
0
through
®

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CY62127DV18L-55BVI Summary of contents

Page 1

... Ultra-low active power — Typical active current: 0 MHz — Typical active current: 3. • Ultra-low standby power • Easy memory expansion with CE</> and OE</> fea- tures • Automatic power-down when deselected • Packages offered in a 48-ball FBGA and a 44-lead TSOP ...

Page 2

Pin Configuration Top View BLE A I/O BHE 8 A I/O I I/O DNU I/O DNU I/O I I/O DNU ...

Page 3

... Supply Voltage to Ground Potential .−0. Voltage Applied to Outputs [3] in High-Z State ....................................−0. Product Portfolio V Range(V) CC Product Min. Typ. CY62127DV18L 1.65 1.8 CY62127DV18LL DC Electrical Characteristics Parameter Description V Output HIGH Voltage OH V Output LOW Voltage OL V Input HIGH Voltage IH V Input LOW Voltage ...

Page 4

AC Test Loads and Waveforms OUTPUT INCLUDING JIG AND SCOPE Equivalent to: OUTPUT Parameters Data Retention Characteristics Parameter Description V V for Data Retention DR CC ...

Page 5

... If both byte enables are toggled together, this value is 10 ns. 11 and t transitions are measured when the outputs enter a high-impedance state. HZOE HZCE HZBE HZWE 12. The internal Write time of the memory is defined by the overlap of WE Document #:38-05226 Rev.*A PRELIMINARY [8] Description [9] [9,11] [9] [9,11] [9] ...

Page 6

Switching Waveforms Read Cycle No. 1 (Address Transition Controlled) ADDRESS DATA OUT PREVIOUS DATA VALID [14,15] Read Cycle No. 2 (OE Controlled) ADDRESS CE OE BHE, BLE t LZBE HIGH IMPEDANCE DATA OUT t LZCE SUPPLY ...

Page 7

Write Cycle No. 1 (WE Controlled) ADDRESS BHE/BLE OE DATA I/O DON'T CARE t HZOE [11,12, 16, 17, 18] Write Cycle No. 2 (CE Controlled) ADDRESS CE WE BHE / BLE OE ...

Page 8

Write Cycle No. 3 (WE Controlled, OE LOW) ADDRESS CE BHE/BLE DATA I/O DON'T CARE Write Cycle No. 4 (BHE</>/BLE</> Controlled, OE</> LOW)</> ADDRESS CE BHE/BLE DATA I/O DON'T CARE Document #:38-05226 Rev.*A PRELIMINARY ...

Page 9

... Ordering Information Speed (ns) Ordering Code 55 CY62127DV18L-55BVI CY62127DV18LL-55BVI CY62127DV18L-55ZI CY62127DV18LL-55ZI Package Diagrams 48-Ball ( mm) Fine Pitch BGA BV48A Document #:38-05226 Rev.*A PRELIMINARY High Z High Z Data Out Data Out High Z Data Out Data Out High Z ...

Page 10

Package Diagrams (continued) MoBL is a registered trademark, and MoBL2 and More Battery Life are trademarks, of Cypress Semiconductor. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05226 Rev. *A ...

Page 11

Document History Page Document Title: CY62127DV18 MoBL2 Document Number: 38-05226 REV. ECN NO. Issue Date ** 118006 10/01/02 *A 127312 06/17/03 Document #:38-05226 Rev.*A PRELIMINARY ® (64K x 16) Static RAM Orig. of Change Description of Change CDY ...

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