W25Q40BVSNIG WINBOND [Winbond], W25Q40BVSNIG Datasheet - Page 68

• Manufacturer Part Number: W25Q40BVSNIG
• Description: 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
• Manufacturer: WINBOND [Winbond]

10.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
SYMBOL
e
A1
A2
D1
E1
A
C
D
E
H
θ
b
L
y
(2)
Min
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
---
0°
MILLIMETERS
1.27 BSC.
Nom
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
---
---
Max
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.10
- 68 -
8°
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
Min
---
0°
0.050 BSC.
INCHES
Nom
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
---
---
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
Max
8°
W25Q40BV
GAUGE PLANE
GAUGE PLANE