W25Q40BVSNIG WINBOND [Winbond], W25Q40BVSNIG Datasheet - Page 70

• Manufacturer Part Number: W25Q40BVSNIG
• Description: 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
• Manufacturer: WINBOND [Winbond]

8-Pad WSON 6x5mm Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid
package.
placement of exposed PCB vias under the pad.
SYMBOL
M
Q
N
P
R
Min
MILLIMETERS
SOLDER PATTERN
Nom
3.40
4.30
6.00
0.50
0.75
- 70 -
Max
Min
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Max
W25Q40BV