W25X64BVSFIG WINBOND [Winbond], W25X64BVSFIG Datasheet - Page 3

• Manufacturer Part Number: W25X64BVSFIG
• Description: 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
• Manufacturer: WINBOND [Winbond]

11.
12.
13.
14.
ELECTRICAL CHARACTERISTICS
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
PACKAGE SPECIFICATION
12.1
12.2
12.3
ORDERING INFORMATION
13.1
REVISION HISTORY
10.2.6
10.2.7
10.2.8
10.2.9
10.2.10
10.2.11
10.2.12
10.2.13
10.2.14
10.2.15
10.2.16
10.2.17
10.2.18
Absolute Maximum Ratings
Operating Ranges
Power-up Timing and Write Inhibit Threshold
DC Electrical Characteristics
AC Measurement Conditions
AC Electrical Characteristics
AC Electrical Characteristics (cont’d)
Serial Output Timing
Input Timing
8-Pin SOIC 208-mil (Package Code SS)
8-Contact 8x6mm WSON (Package Code ZE)
16-Pin SOIC 300-mil (Package Code SF)
Valid Part Numbers and Top Side Marking
Hold Timing
Write Status Register (01h)
Read Data (03h)
Fast Read (0Bh)
Fast Read Dual Output (3Bh)
Page Program (02h)
Sector Erase (20h)
32KB Block Erase (52h)
Block Erase (D8h)
Chip Erase (C7h or 60h)
Power-down (B9h)
Release Power-down / Device ID (ABh)
Read Manufacturer / Device ID (90h)
JEDEC ID (9Fh)
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Publication Release Date: August 7, 2009
Preliminary -- Revision B
W25X64BV