W25X64BVSFIG WINBOND [Winbond], W25X64BVSFIG Datasheet - Page 38

• Manufacturer Part Number: W25X64BVSFIG
• Description: 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
• Manufacturer: WINBOND [Winbond]

12.1 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
12. PACKAGE SPECIFICATION
SYMBOL
D1
A1
A2
E1
A
C
D
H
b
E
e
L
y
θ
MIN
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
0°
-
MILLIMETERS
1.27 BSC
NOM
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
-
-
0.010
- 38 -
MAX
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
8°
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
MIN
0°
-
0.050 BSC
INCHES
NOM
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
-
-
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
MAX
W25X64BV
8°