HIP2500IP HARRIS [Harris Corporation], HIP2500IP Datasheet - Page 7

• Manufacturer Part Number: HIP2500IP
• Description: Half Bridge 500VDC Driver
• Manufacturer: HARRIS [Harris Corporation]

SEATING
INDEX
AREA
PLANE
PLANE
Dual-In-Line Plastic Packages (PDIP)
NOTES:
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
BASE
1. Controlling Dimensions: INCH. In case of conflict between
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
4. Dimensions A, A1 and L are measured with the package seated
5. D, D1, and E1 dimensions do not include mold flash or protru-
6. E and
7. e
8. B1 maximum dimensions do not include dambar protrusions.
9. N is the maximum number of terminal positions.
D1
B1
English and Metric dimensions, the inch dimensions control.
2.2 of Publication No. 95.
in JEDEC seating plane gauge GS-3.
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
pendicular to datum
strained. e
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
-A-
B
and e
N
1 2 3
B
e
C
A
are measured at the lead tips with the leads uncon-
C
are measured with the leads constrained to be per-
must be zero or greater.
D
0.010 (0.25)
-C-
e
N/2
.
D1
M
-C-
E1
C A
-B-
A1
A2
B S
L
e
A
C
e
e
C L
E
A
B
C
HIP2500
7
E14.3
14 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
A1
A2
B1
D1
E1
e
e
C
D
N
A
B
E
e
L
A
B
(JEDEC MS-001-AA ISSUE D)
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.300
0.240
0.115
MIN
-
-
0.100 BSC
0.300 BSC
INCHES
14
0.210
0.195
0.022
0.070
0.014
0.775
0.325
0.280
0.430
0.150
MAX
-
-
18.66
0.39
2.93
0.356
1.15
0.204
0.13
7.62
6.10
2.93
MIN
MILLIMETERS
-
-
2.54 BSC
7.62 BSC
14
19.68
10.92
5.33
4.95
0.558
1.77
0.355
8.25
7.11
3.81
MAX
-
-
Rev. 0 12/93
NOTES
4
4
8
5
5
6
5
6
7
4
9
-
-
-
-